Silicon Coating on Hard Shields for Sputter Chamber Walls

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Solution Overview

Problem

Sputter coating chambers experience increased defects and reduced throughput due to excess coating material adhering to walls and fracturing, leading to decreased yield and capacity.

Innovation Solution

A device comprising a hard shield material with a layer of aluminum or copper applied using a twin wire arc spray process, followed by a silicon layer of specific thicknesses applied using both plasma spray and sputter deposition processes to minimize defects and stress, thereby reducing material accumulation on chamber walls.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If sputter coating is used to deposit coating material, then coating can be applied to substrates, but excess coating material accumulates on chamber walls creating defects

Engineering Contradiction:
Improvecoating qualityVSAvoiddefects from wall coating fracture
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

A hard shield material is introduced as an intermediary component to capture excess coating material that would otherwise accumulate on chamber walls and create defects. The hard shield acts as a sacrificial element that protects the chamber walls from coating buildup.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The hard shield is designed as a consumable component that can be replaced periodically. Instead of cleaning or maintaining the chamber walls, the sacrificial hard shield absorbs the harmful coating accumulation and is then replaced, reducing downtime and maintaining coating quality.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Productivity

If coating material accumulates on chamber walls, then coating deposition continues, but the coating fractures and falls apart creating dust and defects

Engineering Contradiction:
ImprovethroughputVSAvoidyield
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The hard shield converts the harmful effect of coating material accumulation into a beneficial outcome by providing a controlled surface for accumulation. The coating material that would otherwise damage the chamber walls and create defects is instead captured on the hard shield, protecting the chamber integrity and maintaining high yield.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Productivity

If multiple coating cycles are performed, then production capacity increases, but the number of defects increases decreasing yield

Engineering Contradiction:
ImprovecapacityVSAvoiddefect rate
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The hard shield is installed in advance to prevent coating material from accumulating on chamber walls before defects can form. By having the hard shield in place beforehand, multiple coating cycles can be performed without the progressive increase in defects that would normally occur with repeated use.

Inventive Principle:
Principle #10Preliminary action

4Ease of manufacture

If aluminum or copper layer is applied using twin wire arc spray, then base layer is formed, but stress builds up in the coating layers

Engineering Contradiction:
Improvecoating applicationVSAvoidcoating durability
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The patent applies a silicon overlay layer that changes the physical and chemical parameters of the coating system. The silicon layer modifies the stress characteristics and adhesion properties of the overall coating structure, reducing stress buildup while maintaining the ease of manufacture provided by the twin wire arc spray process.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The coating structure is designed as a composite material system with an aluminum or copper base layer followed by a silicon overlay layer. This composite structure combines the benefits of the base layer (ease of application) with the silicon layer's ability to reduce stress and improve durability.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces defects, increases yield and throughput, and enhances durability by minimizing material accumulation and stress within the coating layers, improving the overall performance and capacity of the coating chamber.

Implementation Method 1

applying on top of the hard shield material a layer using a twin wire arc spray process

Methodology Applied
Scientific EffectElectric arc: Electric Arc

Implementation Method 2

applying on top of the hard shield material a layer using a twin wire arc spray process

Methodology Applied
Scientific EffectArc deposition: Cathodic Arc Deposition

Implementation Method 3

applying on top of the layer applied using the twin wire arc spray process a silicon layer having a first thickness using a plasma spray process

Methodology Applied
Scientific EffectPlasma spray: Plasma Spray

Implementation Method 4

Each cycle of use of the sputter coating chamber increases the number and types of defects

Methodology Applied
Scientific EffectSputtering: Sputtering

Data Source

PatentUS11486042B2Silicon coating on hard shields
Publication Date: 2022.11.01 VIAVI SOLUTIONS INC(US)
  • US11486042B2 patent drawing
  • US11486042B2 patent drawing
  • US11486042B2 patent drawing

AI summary

A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.