Silicon-Based Heat Sink Thermal Decoupling
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Solution Overview
Problem
In electrically-driven devices packed in close proximity, thermal energy dissipation is inadequate, leading to performance degradation and reduced lifespan due to thermal coupling, and existing metal-based cooling solutions face issues like oxidation, corrosion, and complexity in compact form factors.
Innovation Solution
The use of silicon-based heat sinks with grooves or openings to thermally decouple and cool electrically-driven devices, sandwiched between non-silicon heat sinks with higher thermal conductivity, effectively dissipating heat while minimizing thermal coupling between adjacent devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal-based heat exchangers and heat pipes are used for cooling, then heat transfer efficiency is improved, but oxidation, corrosion and crystallization occur after long periods of operation reducing efficiency
Solution Approach 1:
The patent changes the material parameter from metal to silicon-based material, which fundamentally alters the chemical properties to resist oxidation and corrosion while maintaining thermal conductivity for effective heat transfer
Solution Approach 2:
The patent uses composite structures including silicon-based heat sinks combined with other materials to achieve both high heat transfer efficiency and resistance to environmental degradation over time
2Productivity
If electrically-driven devices are packed in close proximity in small form factor, then device density is improved, but thermal coupling occurs between adjacent devices causing performance degradation
Solution Approach 1:
The silicon-based heat sink is segmented with grooves and openings that divide the thermal pathways, allowing each device to have its own heat dissipation route while preventing thermal coupling between adjacent devices
Solution Approach 2:
The heat sink structure has different local properties - solid regions for heat conduction and grooved regions for thermal isolation - optimizing both heat removal and thermal decoupling in different locations
3Temperature
If conventional metal-based cooling packages are used, then cooling capability is improved, but manufacturing complexity and cost increase due to precision alignment and fabrication requirements
Solution Approach 1:
Changing from metal to silicon-based materials enables the use of semiconductor manufacturing techniques which are more suitable for precision fabrication and integration, reducing overall manufacturing complexity despite the need for precise structures
4Ease of operation
If wire bonding is used to provide electrical power to devices, then electrical connection is achieved, but manufacturing cost and complexity increase and space is occupied unnecessarily
Solution Approach 1:
The patent merges the thermal management function and electrical interconnection function into a single silicon-based substrate, eliminating the need for separate wire bonding operations and reducing both complexity and space requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat transfer efficiency, reduces manufacturing complexity and cost, and prevents thermal coupling, thereby improving the performance and lifespan of electrically-driven devices in compact form factors.
Implementation Method 1
a heat conduction path between the first electrically-driven device and the first non-silicon heat sink through the first silicon-based heat sink
Implementation Method 2
The first non-silicon heat sink may have a higher thermal conductivity than the first silicon-based heat sink
Data Source
AI summary
Various embodiments of an apparatus that simultaneously cools and thermally decouples adjacent electrically-driven devices in close proximity are provided. In one aspect, an apparatus comprises a first non-silicon heat sink and a first silicon-based heat sink disposed on the first non-silicon heat sink. The first silicon-based heat sink is configured to receive a first electrically-driven device on a first portion of the first silicon-based heat sink and to receive a second electrically-driven device on a second portion of the first silicon-based heat sink. The first silicon-based heat sink includes a first groove or a first opening between the first portion and the second portion such that a heat conduction path between the first electrically-driven device and the first non-silicon heat sink through the first silicon-based heat sink is shorter than a heat conduction path between the first electrically-driven device and the second electrically-driven device through the first silicon-based heat sink.