Silicon Part Hub Assembly Using Plastic Deformation Locking

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Solution Overview

Problem

The challenge in assembling silicon parts on supports for MEMS systems is the fragility of silicon components, which can lead to micro-breakages and uncontrolled geometry variations during assembly, requiring a method that ensures precision, mechanical integrity, and reduced assembly time while avoiding the use of adhesives that add excess thickness.

Innovation Solution

A method involving controlled plastic deformation of a deformable portion on the support to create a stop that holds the silicon part in place, eliminating the need for adhesives and reducing the risk of micro-ruptures, by using a tool to deform the support material, such as stainless steel or thermoplastic, without applying stress to the silicon part.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If driving or riveting techniques are used to assemble silicon part on support, then assembly strength is improved, but silicon part integrity deteriorates due to micro-fractures

Engineering Contradiction:
Improveassembly strengthVSAvoidsilicon part integrity
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

Instead of applying force to the silicon part to secure it to the support (conventional driving/riveting), the invention inverts the approach by deforming a portion of the support itself to create an interference fit that secures the silicon part. The support is shaped to complement the silicon part geometry, and deformation of the support creates friction and mechanical interlocking without stressing the brittle silicon component.

Inventive Principle:
Principle #13The other way round (Inversion)

2Manufacturing precision

If adhesive is used to bond silicon part to support, then assembly precision is improved, but assembly time increases due to waiting period

Engineering Contradiction:
Improveassembly precisionVSAvoidassembly time
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The invention replaces the chemical bonding mechanism of adhesives with a mechanical interference fit system. The support is designed with a deformable portion that, when deformed, creates friction and mechanical interlocking with the silicon part. This eliminates the need for adhesive curing time while maintaining precise positioning through geometric complementarity and friction-based holding.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If adhesive is used to assemble silicon part on support, then bonding strength is improved, but excess thickness is generated complicating manufacturing

Engineering Contradiction:
Improvebonding strengthVSAvoidmanufacturing complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the adhesive layer from the assembly system entirely. By using a mechanical interference fit where the support is deformed to create friction-based holding, the adhesive is completely removed from the process. This eliminates the excess thickness problem and the associated manufacturing complications of adhesive application, curing, and thickness control.

Inventive Principle:
Principle #2Taking out (Extraction)

4Ease of manufacture

If conventional assembly techniques are used on silicon part, then assembly simplicity is improved, but positioning precision deteriorates due to micro-breakages

Engineering Contradiction:
Improveassembly simplicityVSAvoidpositioning precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The invention applies local quality by creating a specialized deformable portion on the support that is specifically designed to interface with the silicon part. This localized feature provides precise geometric complementarity and friction-based holding exactly where needed, ensuring accurate positioning without requiring complex assembly procedures. The rest of the support maintains its simple structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method ensures precise assembly with reduced risk of mechanical deformation, eliminates the need for waiting times for adhesives to set, and simplifies the manufacturing process by avoiding excess thickness issues, thereby enhancing the mechanical and functional integrity of the silicon parts.

Implementation Method 1

plastically deforming the deformable portion by mechanically stressing the deformable portion using the tool

Methodology Applied
Scientific EffectPlastic deformation: Plasticity

Data Source

PatentEP4137447B1Method for assembling a silicon part on a support
Publication Date: 2024.06.12 SILMACH
  • EP4137447B1 patent drawingFigure 1
  • EP4137447B1 patent drawingFigure 2a~2b
  • EP4137447B1 patent drawingFigure 3~4

AI summary

The present invention relates to a method of assembling a silicon part (11) onto a hub (12), the silicon part (11) comprising a central through opening (111), an inner edge (110) delimiting the central through opening (111) and at least one notch (130) extending from the inner edge (110), and the hub (12) comprising a deformable portion, the method comprising steps of: placing the hub (12) inside the central opening (111), bringing (200) a tool (14) into contact with the deformable portion;plastically deform (300) the deformable portion by mechanical stressing of the deformable portion using the tool (14), so that once deformed, the deformable portion extends against the part (11) forming a stop holding the part (11) in position on the hub (12), wherein the plastic deformation step (300) has the effect of deforming the hub (12) by forming a boss to fill a space in the notch (130), so as to lock the hub (12) against rotation on the part (11).;