Silicon Interposer Sandwich Shielding for Dense 3D IC Packaging
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Solution Overview
Problem
Current 3D packaging technologies fail to effectively miniaturize electronics while providing adequate protection against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Compatibility (EMC) without compromising the scale of integration, as existing shielding methods require larger structures and separate packages for individual devices.
Innovation Solution
A sandwich structure of interposers with metallized shielding and diode protective devices is used, where TSVs connect the interposers to ground or voltage, allowing for miniaturized localized shielding and enabling multiple integrated circuit devices to be placed adjacent to each other on the same interposer, maintaining miniaturization and providing ESD, EMI, and EMC protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional shielding structures with base plates, lids, and gaskets are used to protect integrated circuit devices from ESD, EMI, and EMC, then protection effectiveness is improved, but device size and structural complexity increase significantly
Solution Approach 1:
The patent segments the shielding function into multiple thin interposer layers (first interposer, second interposer, third interposer) rather than using a single monolithic shielding structure. Each interposer contains conductive elements that provide specific shielding functions, allowing the overall shielding system to be distributed and integrated within the 3D packaging structure itself.
Solution Approach 2:
The patent implements nesting by placing conductive shielding elements within the interposer layers that are themselves nested between integrated circuit devices. The first interposer is positioned between the first device and second device, the second interposer between the second device and third device, creating a nested arrangement where shielding structures are embedded within the packaging hierarchy.
2Reliability
If traditional shielding structures with base plates, lids, and gaskets are used to protect integrated circuit devices from ESD, EMI, and EMC, then protection effectiveness is improved, but the desired miniaturization is compromised
Solution Approach 1:
The patent transitions from traditional 2D planar shielding structures to a 3D vertical arrangement where thin interposer layers are stacked between devices. The shielding function is achieved through multiple thin layers in the vertical dimension rather than large lateral extensions, enabling miniaturization while maintaining protection effectiveness.
Solution Approach 2:
The patent uses thin interposer films/layers (first interposer, second interposer, third interposer) as flexible shielding structures instead of rigid base plates and lids. These thin interposer layers can be integrated within the compact 3D packaging volume without requiring the bulky traditional shielding enclosures.
3Productivity
If multiple integrated circuit devices are placed on the same interposer to enhance functional proximity and miniaturization, then device density is improved, but isolation from ESD, EMI, and EMC factors deteriorates
Solution Approach 1:
The patent segments the space between multiple integrated circuit devices by inserting conductive interposer layers (first interposer, second interposer, third interposer) between adjacent devices. This segmentation creates electrical isolation barriers that protect each device from ESD, EMI, and EMC while allowing the devices to remain in close proximity for enhanced functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively shields and protects integrated circuit devices in 3D packaging from ESD, EMI, and EMC while preserving miniaturization, allowing for closer device placement and efficient heat dissipation, thus enhancing the scale of integration and reducing the need for larger shielding structures.
Implementation Method 1
metallized shielding and diode protective devices may be incorporated into both the top and bottom interposers
Implementation Method 2
protected against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC)
Implementation Method 3
TSV's would allow interconnection of the metallized shielding to ground or voltage as required electrically
Implementation Method 4
allowing efficient dissipation of heat
Data Source
AI summary
An interposer sandwich structure includes a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes an attachment for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.