Silicon Interposer Laser Module With Integrated Optical Routing

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Solution Overview

Problem

Optical data communication systems face challenges in achieving reliable and efficient laser light sources and optical processing devices with minimal form factor and low energy consumption, which are essential for effective data transmission and decoding.

Innovation Solution

The development of an interposer device that integrates a laser source chip, silicon photonics chip, and optical amplifier module with optical conveyance structures to connect these components efficiently, along with a mechanical transfer ferrule for alignment, enables the creation of a compact and efficient multi-chip module for optical data communication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple separate components (laser source, silicon photonics chip, optical amplifier) are used to ensure reliable optical data communication, then the system reliability is improved, but the device complexity and form factor increase

Engineering Contradiction:

Improvereliability of optical data communicationVSAvoidcomplexity of multi-component system

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple separate optical components (laser source chip, silicon photonics chip, and optical amplifier module) into a single integrated laser module. The substrate integrates optical conveyance structures, electrical interconnects, and mechanical alignment features to unify these components into one compact assembly, thereby maintaining system reliability while reducing overall device complexity and form factor.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a nested arrangement where the laser source chip, silicon photonics chip, and optical amplifier module are stacked or positioned in close proximity on a common substrate. The mechanical transfer ferrule and alignment keys enable precise nesting of these components, allowing each to be housed within the overall module footprint without requiring separate external assemblies.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Productivity

If multiple separate components are used to achieve efficient optical processing, then the processing efficiency is improved, but the energy consumption increases

Engineering Contradiction:

Improveefficiency of optical data transmissionVSAvoidenergy consumption of optical module

Core Design Contradiction:

ProductivityVSUse of energy by moving object

Solution Approach 1:

The substrate acts as an intermediary that efficiently couples the laser source, silicon photonics chip, and optical amplifier module. The integrated optical conveyance structures and electrical interconnects minimize signal loss and energy dissipation between components, enabling efficient optical processing while reducing the total energy required compared to separate external connections.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If separate components with individual interfaces are used, then the adaptability of the system is improved, but the manufacturing complexity and cost increase

Engineering Contradiction:

Improveadaptability of optical communication systemVSAvoidease of manufacturing multi-chip module

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent incorporates preliminary alignment features directly into the substrate design, including mechanical transfer ferrules, alignment keys, and pre-configured optical conveyance structures. These features are manufactured into the substrate before component assembly, enabling precise alignment and simplified integration of the laser source chip, silicon photonics chip, and optical amplifier module during the manufacturing process.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS11799554B2Laser module for optical data communication system within silicon interposer

Publication Date: 2023.10.24 AYAR LABS INC

AI summary

An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.