Optical Package Interposer Structure for Stable Fiber Coupling
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Solution Overview
Problem
Traditional optical packages using wire bonding and basic support structures fail to provide mechanical stability and efficient connectivity for advanced Co-packaged optics (CPO) components, leading to signal integrity issues and increased space demands.
Innovation Solution
The implementation of a silicon interposer layer and an electronic mold compound (EMC) layer, which together form a mechanically stable optical package with increased signal integrity and connectivity, using conductive paths and pillars for thermal dissipation and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If traditional wire bonding and basic support structures are used, then the optical package structure is simple, but mechanical stability and signal integrity deteriorate
Solution Approach 1:
The patent employs a composite structure consisting of a silicon interposer layer combined with an electronic mold compound (EMC) layer. This composite material approach provides enhanced mechanical stability and structural support while maintaining signal integrity for advanced CPO components, directly resolving the contradiction between mechanical stability and structural complexity
Solution Approach 2:
The silicon interposer layer serves as an intermediary component between the substrate and the CPO components. It provides a mechanically stable platform with integrated conductive paths, acting as a mediator that enhances structural stability without requiring complex wire bonding structures
2Speed
If advanced CPO components are integrated, then speed and performance improve, but space requirements and component density increase
Solution Approach 1:
The patent utilizes a multi-layer vertical architecture with the silicon interposer layer positioned above the substrate and CPO components mounted on the interposer. This vertical stacking approach allows advanced high-speed components to be integrated in the vertical dimension rather than spreading out horizontally, thereby maintaining signal transmission speed while reducing the horizontal package area
Solution Approach 2:
The silicon interposer layer performs multiple functions simultaneously: it provides mechanical support, establishes electrical connectivity through integrated conductive paths, and serves as a mounting platform for CPO components. This multi-functionality enables space-efficient integration of high-performance components without requiring additional dedicated structures for each function
3Reliability
If basic support structures are used, then manufacturing is simple, but signal integrity and thermal management deteriorate
Solution Approach 1:
The patent changes the material parameter by using a silicon interposer layer with specific mechanical and electrical properties, rather than traditional organic substrates. This parameter change enables improved signal integrity and thermal management while the interposer's integrated conductive paths simplify the manufacturing process by eliminating complex wire bonding steps
Data Source
AI summary
An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silicon vias (TSVs) and positioned on the EMC layer. A combined thickness of the EMC layer and the silicon interposer layer provide a combined mechanical coupling thickness for a connection component on a smooth diced edge side of the EMC layer and the silicon interposer layer. The optical package also includes devices attached to the silicon interposer layer.