Silicon Interposer Laser Module With Integrated Optical Routing
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Solution Overview
Problem
Optical data communication systems face challenges in achieving reliable and efficient laser light sources and optical processing devices with minimal form factor and low energy consumption, which are essential for effective data transmission and decoding.
Innovation Solution
The development of an interposer device that integrates a laser source chip, silicon photonics chip, and optical amplifier module with optical conveyance structures to connect these components efficiently, along with a mechanical transfer ferrule for alignment, enables the creation of a compact and efficient multi-chip module for optical data communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple separate components (laser source, silicon photonics chip, optical amplifier) are integrated into a single interposer device, then the form factor is minimized and energy consumption is reduced, but the device complexity increases
Solution Approach 1:
The patent combines multiple separate optical components (laser source chip, silicon photonics chip, and optical amplifier module) into a single integrated interposer device. This merging of components reduces the overall form factor and minimizes the space required, while maintaining the functional capabilities of each individual component through their integration on a common substrate.
Solution Approach 2:
The interposer device serves multiple functions simultaneously: it acts as a mounting substrate for the laser source chip, provides optical conveyance structures for light transmission, integrates the silicon photonics chip for signal processing, and incorporates the optical amplifier module for signal amplification. This multi-functionality allows a single device to replace what would traditionally require multiple separate components.
2Reliability
If optical conveyance structures are formed within the substrate to connect multiple chips, then the connection reliability is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The optical conveyance structures are formed within the substrate during the manufacturing process, before the actual chip mounting and alignment operations. This preliminary formation of optical paths ensures that the optical connections are pre-established with proper alignment, reducing the precision requirements during subsequent assembly steps and improving overall connection reliability.
3Manufacturing precision
If a mechanical transfer ferrule with alignment keys is used to align chips, then the alignment precision is improved, but the device complexity increases
Solution Approach 1:
The mechanical transfer ferrule with alignment keys acts as an intermediary alignment mechanism between the different chip components. The alignment keys on the ferrule interface with corresponding features on the chips and substrate, providing a mechanical guide that ensures precise alignment during the assembly process without requiring complex alignment systems.
Data Source
AI summary
An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.