Silicon Oxide Laminate Bonding With Low-Particle Adhesive Layers
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Solution Overview
Problem
Existing methods for bonding silicon substrates do not achieve sufficient adhesion strength between the substrates, necessitating a more robust bonding process.
Innovation Solution
A production method involving silicon substrates with bonding parts containing silicon oxide, using a composition with organic and inorganic materials to form an adhesive layer with controlled particle counts, ensuring a low cluster density on the adhesive surface to enhance bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive layer is formed using conventional composition with high particle count, then adhesion strength between silicon substrates is improved, but void formation increases and bond stability deteriorates
Solution Approach 1:
The patent changes the particle concentration parameter from conventional high levels (typically 10,000-100,000 particles/mL) to a specifically controlled low level of 1-3,000 particles/mL. This parameter change reduces void formation in the adhesive layer while maintaining adequate adhesion strength through the chemical reaction between silane-modified adhesive particles and silicon oxide surfaces.
Solution Approach 2:
The patent uses composite adhesive particles comprising silane-modified organic polymer particles with inorganic oxide cores (such as silica). This composite structure provides both the adhesion functionality through surface silane groups and the structural integrity needed to minimize voids, resolving the contradiction between strength and reliability.
2Strength
If adhesive layer is formed with high particle concentration, then adhesion strength increases, but manufacturing precision of uniform adhesive layer deteriorates
Solution Approach 1:
The patent changes the particle concentration parameter to 1-3,000 particles/mL, which is sufficiently low to allow uniform distribution and coating while maintaining adequate adhesion through enhanced chemical bonding efficiency. This parameter change enables precise control of adhesive layer thickness and uniformity.
Solution Approach 2:
The patent replaces reliance on mechanical interlocking (which requires high particle concentrations) with chemical bonding mechanisms. The silane-modified particles form covalent bonds with silicon oxide surfaces, substituting mechanical adhesion with chemical adhesion, thereby enabling uniform layers at low particle concentrations.
3Strength
If conventional adhesive composition is used, then adhesion strength is achieved, but void formation increases reducing bond reliability
Solution Approach 1:
The patent changes the particle concentration parameter to 1-3,000 particles/mL, which significantly reduces void formation by ensuring adequate spacing between particles during coating and curing. This low concentration prevents particle aggregation and allows complete wetting of the substrate surface, eliminating voids that would compromise bond reliability.
Solution Approach 2:
The patent introduces silane-modified adhesive particles as intermediaries that chemically bridge the silicon substrate surfaces. These particles contain hydrolyzable groups that form covalent bonds with silicon oxide, acting as molecular mediators that eliminate the need for high particle concentrations and prevent void formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a bonding strength of 1.00 J/m² or more between silicon substrates, effectively increasing adhesion while minimizing void formation and maintaining a stable bond.
Implementation Method 1
an organic material reactable with a hydrosilyl group and/or a silanol group
Implementation Method 2
reactable with a hydrosilyl group
Implementation Method 3
an inorganic material bondable to silicon oxide
Data Source
Figure 1~2
Figure 3
AI summary
A method for producing a layered product including two silicon substrates, comprising: (a) providing a first silicon substrate having a first bonding part and a second silicon substrate having a second bonding part, wherein the first bonding part and the second bonding part each include silicon oxide; (b) providing a first composition including at least one of an organic material reactable with a hydrosilyl group and/or a silanol group, and an inorganic material bondable to silicon oxide, and having an amount of particles of 3,000 pieces/mL or less; and (c) with use of at least one of the organic material and the inorganic material, disposing an adhesive layer that bonds the first bonding part and the second bonding part with the organic material and/or a reaction product derived from the organic material, or bonds the first bonding part and the second bonding part with the inorganic material and/or a reaction product derived from the inorganic material, wherein the adhesive layer includes a first adhesive part disposed on the first bonding part, and the number of clusters of the particles included in the surface of the first adhesive part on the opposite side of the first bonding part is 5 pieces/cm2 or less.