III-V Laser Waveguide Integration on Silicon at Low Deposition Temperature

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Solution Overview

Problem

Existing fabrication techniques for integrating group III/V compound semiconductor lasers with silicon-based photonic integrated circuits are costly, wasteful, and not scalable, and there is a lack of a fully integrated laser source in silicon-photonics applications, with complex circuitry and inefficient optoelectronic coupling of waveguides to high-quality III/V gain layers.

Innovation Solution

A semiconductor device comprising a group IV substrate, a waveguide with a refractive index between 1.3 and 3.8, and a group III/V multilayer stack, including quantum components like quantum dots or wires, which allows for low-temperature deposition and efficient optical coupling with minimal insertion loss, using materials like silicon oxynitride and silicon nitride for the waveguide.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If group III/V compound semiconductor lasers are integrated with silicon-based photonic integrated circuits using known fabrication techniques, then laser functionality is achieved, but manufacturing cost increases and material waste occurs

Engineering Contradiction:
Improvelaser functionalityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the laser gain chip and waveguide onto a single silicon substrate, eliminating the need for separate integration steps. The quantum component is directly formed on the silicon substrate with the waveguide, consolidating multiple components into one integrated structure that reduces manufacturing complexity and cost.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The silicon substrate serves multiple functions: as the mechanical support, as the waveguide platform, and as the base for the quantum component. This multi-functionality eliminates the need for separate substrates for each component, reducing material waste and simplifying the manufacturing process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If group III/V compound semiconductor lasers are integrated with silicon-based photonic integrated circuits using known fabrication techniques, then laser functionality is achieved, but scalability is limited

Engineering Contradiction:
Improvelaser functionalityVSAvoidscalability
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

By combining all laser components (quantum component, waveguide, and support structure) into a single integrated device fabricated in one process flow, the invention enables wafer-scale production. This unified structure can be manufactured using standard semiconductor fabrication techniques that are inherently scalable to large wafer volumes.

Inventive Principle:
Principle #5Merging (Combining)

3Object-affected harmful factors

If waveguide deposition temperature is reduced below 550 degrees Celsius, then adverse effects on other components are avoided, but deposition process constraints increase

Engineering Contradiction:
Improveadverse effects on componentsVSAvoiddeposition process constraints
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent changes the deposition temperature parameter to below 550 degrees Celsius, which prevents thermal damage to the quantum component and other sensitive structures. This temperature parameter adjustment allows the use of low-temperature deposition techniques such as atomic layer deposition or chemical vapor deposition that are compatible with the quantum component.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The waveguide material acts as an intermediary between the quantum component and the external optical environment. By using materials that can be deposited at low temperatures, the waveguide protects the quantum component from high-temperature processing while still providing the necessary optical guiding function.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Loss of energy

If waveguide refractive index is optimized between 1.3 and 3.8, then optical coupling efficiency is improved, but material selection constraints increase

Engineering Contradiction:
Improveinsertion lossVSAvoidmaterial selection constraints
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

The patent optimizes the waveguide refractive index parameter to be between 1.3 and 3.8, which maximizes optical coupling efficiency and minimizes insertion loss. This refractive index range is achieved by selecting appropriate materials such as silicon nitride, silicon oxynitride, or other dielectric materials that provide the required optical properties.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The waveguide may use composite material structures such as silicon nitride or silicon oxynitride that combine different elemental components to achieve the desired refractive index. These composite materials provide both the required optical properties and compatibility with low-temperature deposition processes.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient optical coupling with low insertion loss, supports a wavelength range of 850-2100 nm, and facilitates industrial feasibility by avoiding adverse effects on other components during manufacturing, allowing for scalable and cost-effective integration of laser sources in silicon-photonics applications.

Implementation Method 1

enables efficient optical coupling with low insertion loss

Methodology Applied
Scientific EffectOptical coupling: Refraction

Implementation Method 2

a waveguide with a refractive index between 1.3 and 3.8

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS12413049B2Optoelectronic semiconductor device
Publication Date: 2025.09.09 UNIVERSITY COLLEGE LONDON
  • US12413049B2 patent drawing
  • US12413049B2 patent drawing
  • US12413049B2 patent drawing

AI summary

A semiconductor device for use in an optoelectronic integrated circuit; the device comprising: a group four substrate, a waveguide, and a group III/V multilayer stack; wherein the group III/V multilayer stack comprises a quantum component for producing light for the waveguide; wherein the waveguide comprises a material with a deposition temperature below 550 degrees Celsius and a refractive index of any value between 1.3 and 3.8.