Silicon-Based LED Package Body for Heat Dissipation and Voltage Protection
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Solution Overview
Problem
Existing light emitting diode (LED) packages face challenges in efficiently supplying current and dissipating heat, while also requiring effective protection against abnormal voltages, which can impact the reliability and performance of the devices.
Innovation Solution
A light emitting device package is designed with a silicon-based body, insulating layers, and metal layers that allow direct contact and connection of compound semiconductor layers, along with a protection device, to facilitate current supply, heat dissipation, and protection against voltage anomalies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a light emitting device is packaged with traditional insulating package body, then electrical isolation is provided, but heat dissipation efficiency deteriorates
Solution Approach 1:
The package body is segmented into distinct functional regions: a first region with high thermal conductivity for heat dissipation, a second region with electrical isolation properties, and a third region serving as a heat sink. This segmentation allows each region to optimize its specific function without compromising overall device performance
Solution Approach 2:
Different regions of the package body are assigned different material properties tailored to their specific functions. The first region uses materials with high thermal conductivity for efficient heat dissipation, while the second region uses insulating materials for electrical isolation, and the third region provides heat sink functionality
2Reliability
If complex packaging structure is used to protect against abnormal voltages, then device protection is improved, but manufacturing complexity increases
Solution Approach 1:
The protection device is integrated directly into the package body structure, merging the protection function with the existing packaging components. This eliminates the need for separate protection structures and reduces manufacturing steps while maintaining effective protection against abnormal voltages
Solution Approach 2:
The package body is designed to serve multiple functions simultaneously: it provides mechanical support, thermal management through different conductivity regions, electrical isolation where needed, and voltage protection through the integrated protection device. This multi-functionality reduces the need for additional components
3Productivity
If direct contact between compound semiconductor layers and package body is implemented, then current supply efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The package body structure, including the first region for direct contact, is prepared in advance during the packaging process. This preliminary preparation of the contact interface simplifies the subsequent assembly steps and reduces the precision requirements during final device mounting
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the current and heat management characteristics of the light emitting device, improves manufacturing processes, and provides effective protection against electrical surges, leading to improved performance and reliability in LED packages.
Implementation Method 1
heat generated from a light emitting device is emitted through a package body
Implementation Method 2
current is supplied to a light emitting device through a package body
Data Source
AI summary
Provided is a light emitting device package. The light emitting device package comprises a body formed of a silicon-based material; an insulating layer having a first opening on a surface of the body; a first and second metal layers disposed on the insulating layer; a light emitting device having a plurality of compound semiconductor layers disposed on a top surface of the body and connected to the first and second metal layers; and a protection device disposed on the body and electrically connected to the light emitting device, wherein the insulating layer has a second opening on a bottom surface of the body, wherein a first portion of the first metal layer is connected to the protective device and is disposed in the second opening of the insulating layer.