Silicon Lens Support with V-Notch Grooves for Laser Alignment
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Solution Overview
Problem
High-power diode lasers face challenges in collimation alignment due to the complexity of aligning collimating lenses, and existing heat dissipation methods for compact heat-generating devices suffer from issues like oxidation and corrosion in metal-based cooling packages, leading to reduced efficiency and compactness.
Innovation Solution
A silicon-based thermal energy transfer apparatus with a base and support structure featuring V-notch grooves and fin portions for precise alignment and heat dissipation, allowing for passive alignment of heat-generating devices and improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a collimating lens is attached to the diode laser facet to achieve fast-axis collimation, then the laser beam divergence is reduced to within a few milli-radians, but the alignment complexity and assembly time increase significantly
Solution Approach 1:
The patent implements self-alignment mechanisms where the collimating lens is pre-positioned in a holder with specific geometric features (V-grooves, flat surfaces) that automatically align with corresponding features on the diode laser package during assembly. This eliminates the need for complex external alignment tools and manual adjustment, allowing the system to self-align through its structural design.
Solution Approach 2:
The collimating lens is pre-aligned and fixed in the lens holder before attachment to the diode laser package. The holder includes pre-formed alignment features such as V-grooves that guide the lens into its correct position, performing the alignment action in advance during manufacturing rather than during final assembly.
2Strength
If epoxy bonding is used to attach the collimating lens to the diode laser frame, then the lens can be secured in position, but the bonding reliability degrades due to thermal cycles and weak adhesion
Solution Approach 1:
The patent employs V-shaped grooves with specific angular geometry (typically 90 degrees) etched into the diode laser package frame. These V-grooves provide precise mechanical engagement for the collimating lens, creating a geometric constraint that maintains alignment stability regardless of thermal expansion or contraction, thereby improving reliability under thermal cycling conditions.
3Temperature
If metal-based cooling packages are used to dissipate heat from compact heat-generating devices, then heat dissipation efficiency is improved, but oxidation and corrosion occur leading to reduced performance over time
Solution Approach 1:
The patent replaces metal-based cooling structures with silicon-based thermal management components. Silicon provides an inherently oxidation-resistant and corrosion-free environment for heat dissipation, eliminating the degradation issues associated with metal cooling packages while maintaining effective thermal conduction to remove heat from compact heat-generating devices.
4Measurement precision
If active alignment is used to align the collimating lens in real-time, then optimal collimation can be achieved, but the process becomes particularly difficult for high-power diode stacks with multiple closely packaged lasers
Solution Approach 1:
The patent implements self-alignment mechanisms where the collimating lens is pre-positioned in a holder with specific geometric features (V-grooves, flat surfaces) that automatically align with corresponding features on the diode laser package during assembly. This eliminates the need for complex external alignment tools and manual adjustment, allowing the system to self-align through its structural design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silicon-based apparatus enhances collimation precision and heat dissipation efficiency, reducing assembly time and costs while maintaining performance across thermal cycles, and provides a compact, corrosion-free solution for high-power diode lasers and other heat-generating devices.
Implementation Method 1
A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device
Data Source
AI summary
A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a base portion and a support portion. The base portion is made of silicon and includes a first primary surface. The first primary surface includes at least first and second V-notch grooves thereon. The support portion is made of silicon and includes at least first and second edges that are interlockingly received in the first and second V-notch grooves when the support portion is mounted on the base portion.