Silicon Deposition Mask Frame Structure for Alignment and Sag Control
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Solution Overview
Problem
Existing deposition masks struggle to achieve high-resolution display panel manufacturing due to alignment accuracy issues and mura defects caused by mask sagging.
Innovation Solution
A deposition mask is designed with a silicon substrate featuring cell areas and a mask frame area, including a mask rip area and an outer frame area. The mask membrane is formed in each cell area, and a first metal frame is disposed in the outer frame area, connected to a second metal frame via welding. This configuration enhances alignment accuracy and prevents mura defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional deposition mask is used, then the manufacturing process is simple, but alignment accuracy is poor and mura defects occur due to mask sagging
Solution Approach 1:
The mask is divided into a silicon substrate and a separate metal frame structure. The metal frame is segmented into multiple parts that are welded to the silicon substrate, allowing independent optimization of each component for alignment precision while maintaining overall structural integrity.
Solution Approach 2:
The mask combines silicon substrate with metal frame structures to create a composite mask system. This composite structure leverages the advantages of both materials: silicon for precision and metal for structural strength, thereby improving alignment accuracy while preventing sagging.
2Reliability
If the mask structure is simplified, then manufacturing is easier, but mask sagging occurs causing mura defects
Solution Approach 1:
The metal frame structure is pre-formed and then welded to the silicon substrate in advance, creating a pre-reinforced mask structure that prevents sagging before the deposition process begins. This preliminary structural preparation ensures mask stability without complicating the overall manufacturing workflow.
Solution Approach 2:
The mask structure parameters are changed by introducing metal frame components with specific dimensions and configurations. These parameter changes enhance the mechanical strength and rigidity of the mask, preventing sagging while maintaining manufacturability through standardized welding processes.
3Manufacturing precision
If a separate structure is added inside the deposition device, then alignment accuracy improves, but device complexity increases
Solution Approach 1:
The alignment function is merged into the mask itself through the integrated metal frame structure welded to the silicon substrate. This eliminates the need for separate alignment structures inside the deposition device, improving alignment accuracy while avoiding increased device complexity.
Solution Approach 2:
The mask structure provides its own alignment capability through the welded metal frame and silicon substrate integration. The mask is self-aligning without requiring external alignment mechanisms in the deposition device, thereby improving precision while keeping the device simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed deposition mask enables the manufacturing of high-resolution display panels by improving alignment accuracy and preventing mura defects associated with mask sagging, thus ensuring superior display quality.
Implementation Method 1
The first metal frame and the second metal frame may be connected to each other by welding.
Data Source
AI summary
A deposition mask includes a silicon substrate including cell areas and a mask frame area excluding the cell areas, the mask frame area including a mask rip area partitioning the cell areas and an outer frame area disposed at an outermost portion of the silicon substrate, a mask rip disposed in the mask rip area, a mask membrane disposed in each of the cell areas, a first metal frame disposed in the outer frame area, and a second metal frame surrounding an outer portion of the silicon substrate and connected to the first metal frame.