Silicon Microchannel Cooler With Integrated TEC Sidewalls
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Solution Overview
Problem
The challenge of efficiently and reliably cooling high power density microchips, particularly in data centers, is exacerbated by the need for adaptable cooling solutions that can manage varying cooling requirements across different chips while maintaining reliability and cost-effectiveness, especially given the high cost and sensitivity of liquid cooling systems.
Innovation Solution
Integration of a silicon-based microchannel fluid cooling system with thermoelectric coolers (TECs) that are co-packaged with the chips, allowing for adjustable heat removal based on power consumption, utilizing p-n junctions to transfer heat efficiently through fluid channels and air cooling mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling systems are used to cool high power density chips, then thermal performance is improved, but system reliability and cost increase due to the sensitivity and expense of liquid cooling equipment
Solution Approach 1:
The cooling system is segmented into two distinct components: a thermoelectric cooler (TEC) device that provides active cooling at the chip level, and a liquid cooling system that handles heat removal. This segmentation allows the TEC to manage temperature control reliably without exposing the entire system to liquid cooling sensitivity risks.
Solution Approach 2:
The thermoelectric cooler acts as an intermediary between the chip and the liquid cooling system. It converts electrical energy to thermal energy transfer, providing a reliable buffer that isolates the chip from direct exposure to liquid cooling uncertainties while still achieving effective heat management.
2Temperature
If liquid cooling systems are used to cool high power density chips, then thermal performance is improved, but cost increases due to the expense of liquid cooling equipment and redundancy requirements
Solution Approach 1:
By segmenting the cooling function into a solid-state TEC component and a liquid cooling system, the design eliminates the need for expensive redundant liquid cooling infrastructure. The TEC handles the critical temperature control, allowing the liquid cooling system to be simplified or eliminated in many applications.
Solution Approach 2:
The thermoelectric cooler replaces the need for complex mechanical liquid cooling systems at the chip level. It uses solid-state Peltier effect devices that convert electrical current directly to heat transfer, eliminating the need for pumps, pipes, and coolant circulation systems that would increase cost and complexity.
3Adaptability or versatility
If different cooling designs are used for different chips, then adaptability to varying cooling requirements is improved, but device complexity increases
Solution Approach 1:
The thermoelectric cooler provides dynamic adaptability through electrical control. By adjusting the electrical current applied to the TEC, the cooling capacity can be precisely tuned to match the thermal requirements of different chips in real-time, without requiring different physical cooling designs for each chip type.
Solution Approach 2:
The system achieves adaptability by changing electrical parameters (current, voltage) to the thermoelectric cooler rather than changing the physical cooling structure. This allows a single standardized cooling design to serve multiple chip types with varying thermal requirements simply by adjusting electrical control parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient, reliable, and adaptable cooling for high power density chips, ensuring consistent operation and reducing the risk of chip failure by automatically adjusting heat removal based on processing demands, thus maintaining system reliability and reducing operational costs.
Implementation Method 1
TEC uses the Peltier effect to create a heat flux at the junction of two different types of materials, e.g., p-type and n-type semiconductors. The amount of heat flow from one side of the TEC to the other side is directly proportional to the applied DC current
Implementation Method 2
silicon-based microchannel fluid cooling system with thermoelectric coolers (TECs) that are co-packaged with the chips, allowing for adjustable heat removal based on power consumption, utilizing p-n junctions to transfer heat efficiently through fluid channels
Data Source
AI summary
A cold plate for cooling microchip. Fluid channels are formed in a semiconductor plate, each channel being defined by sidewalls. The sidewalls are doped with series of interchanging n-type and p-type regions, thereby generating a plurality of p-n junction in each sidewall. Electrical contacts are provided across the p-n junctions, thereby creating a plurality of thermoelectric cooling (TEC) devices within the sidewalls. Upon application of current to the contacts, the TEC devices transport and draw heat flux away from the microchip. The heat is then fully or partially collected by the cooling fluid flowing inside the channels.