Silicon Modulation Chip for Wavelength-Stable Optical Coupling
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Solution Overview
Problem
Silicon-based light emission modules face issues with temperature sensitivity affecting refractive index, leading to wavelength shifts in multiplexers-demultiplexers and low coupling alignment tolerance, which hinder efficient optical path coupling and increase fabrication costs.
Innovation Solution
A modulation chip comprising a multiplexer-demultiplexer and silicon light modulator, integrated on a ceramic substrate, processes optical signals to achieve specific wavelengths and frequencies, using couplers and array waveguides for efficient signal separation and synthesis, and a temperature controller to stabilize wavelengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If silicon-based multiplexer-demultiplexer is used without temperature control, then device complexity is reduced, but wavelength stability deteriorates due to temperature-sensitive refractive index changes
Solution Approach 1:
The patent replaces the mechanical/thermal temperature control system with an athermal waveguide structure design. The waveguide is engineered to be insensitive to temperature changes through its geometric configuration and material composition, eliminating the need for active thermal management while maintaining wavelength stability.
Solution Approach 2:
The patent changes the physical parameters of the waveguide structure (dimensions, material composition, cross-sectional geometry) to achieve athermal operation. By carefully selecting and optimizing these parameters, the waveguide's effective refractive index becomes insensitive to temperature variations, thereby stabilizing the operating wavelength without active control.
2Area of stationary object
If silicon-based multiplexer-demultiplexer with small sizes is used, then integration density is improved, but coupling alignment tolerance deteriorates
Solution Approach 1:
The patent implements preliminary alignment features directly into the chip fabrication process, such as pre-formed alignment marks, mechanical registration features, and standardized mounting interfaces. These features are created during chip manufacturing to facilitate precise alignment during module assembly, compensating for the small size of the multiplexer-demultiplexer.
Solution Approach 2:
The patent introduces intermediary alignment structures and methods between the multiplexer-demultiplexer and connected components. These intermediaries (such as alignment marks, mechanical fixtures, or optical alignment aids) mediate the coupling process, enabling precise alignment even when the active components are very small.
3Measurement precision
If multiple laser chips are used to achieve specific wavelengths, then wavelength precision is improved, but device complexity and cost increase
Solution Approach 1:
The patent makes a single laser chip perform multiple wavelength functions through the use of an athermal multiplexer-demultiplexer system. The laser emits a broad spectrum, and the multiplexer-demultiplexer selectively routes different wavelengths to appropriate output channels, allowing one laser to replace what would traditionally require multiple wavelength-specific lasers.
Solution Approach 2:
The patent extracts the wavelength selection function from the laser source itself and places it in the multiplexer-demultiplexer system. Instead of requiring each laser to be tuned to a specific wavelength, the system extracts the desired wavelength from the broad-spectrum laser output through optical filtering and routing mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances optical path coupling efficiency and reduces costs by utilizing a single broad-spectrum laser chip, minimizing spatial inconsistencies and maintaining wavelength stability, thereby simplifying manufacturing and reducing costs.
Implementation Method 1
the multiplexer-demultiplexer is configured to receive a first optical signal, process the first optical signal to obtain one second optical signal including at least one preset wavelength, and output the one second optical signal
Implementation Method 2
the silicon light modulator is configured to receive the one second optical signal, perform frequency modulation on the one second optical signal, and output the one second optical signal that has been performed the frequency modulation
Implementation Method 3
the temperature controller is configured to control temperature of the modulation chip, so as to keep the wavelength of the optical signal stable
Data Source
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Figure 3
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AI summary
Disclosed in the embodiments of the present disclosure is a modulation chip. The chip comprises: a multiplexer-demultiplexer and a silicon light modulator, the multiplexer-demultiplexer being used for receiving a first optical signal, processing the first optical signal to obtain a second optical signal including at least one preset wavelength, and outputting the second optical signal; the first optical signal being a light wave including at least one wavelength; the silicon light modulator being used for receiving the second optical signal, performing frequency modulation on the second optical signal, and outputting a frequency-modulated second optical signal.