Silicon Mounting Component for Optical Fiber Alignment
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Solution Overview
Problem
Existing optical modules face challenges in achieving precise alignment of laser devices and optical fibers, particularly in three-dimensional submicron-order precision, and require costly active alignment processes, while also needing hermetic sealing to prevent moisture and impurity accumulation.
Innovation Solution
A mounting component formed from silicon with a groove portion for fixing the optical fiber and a recessed portion for accommodating the laser device, utilizing surface-activated bonding and a stopper layer for precise alignment and hermetic sealing, allowing for both precise alignment and cost-effective fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment process is used to achieve highly precise alignment, then alignment precision is improved, but fabrication cost increases due to longer alignment time
Solution Approach 1:
The mounting component is pre-formed with integrated groove portions and recessed portions that establish precise geometric relationships between optical fiber and laser device positions. This preliminary structuring enables passive alignment to achieve submicron precision without requiring time-consuming active alignment processes, thereby reducing fabrication costs while maintaining high alignment precision.
2Productivity
If passive alignment process is used to reduce fabrication cost, then fabrication cost is reduced, but alignment precision deteriorates compared to active alignment
Solution Approach 1:
The mounting component is pre-formed with integrated groove portions and recessed portions that establish precise geometric relationships between optical fiber and laser device positions. This preliminary structuring enables passive alignment to achieve submicron precision without requiring time-consuming active alignment processes, thereby reducing fabrication costs while maintaining high alignment precision.
3Reliability
If hermetic sealing structure is added to protect laser device, then reliability is improved, but device complexity increases
Solution Approach 1:
The mounting component combines multiple functions into a single integrated structure: the groove portions fix the optical fiber, the recessed portions accommodate the laser device, and the entire component provides hermetic sealing protection. This merging eliminates the need for separate sealing structures, reducing device complexity while maintaining reliability.
Solution Approach 2:
The mounting component serves multiple purposes simultaneously: mechanical support for optical fiber and laser device, precise alignment reference through groove and recessed geometries, and hermetic sealing protection. This multi-functionality reduces the overall number of components needed, simplifying the device structure while ensuring protection against moisture and impurities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables higher precision alignment of laser devices and optical fibers, reduces fabrication costs, and provides effective hermetic sealing to protect the laser device from environmental factors.
Implementation Method 1
utilizing surface-activated bonding and a stopper layer for precise alignment and hermetic sealing
Implementation Method 2
a thickness of the mounting component, measured in a direction perpendicular to the bonding surface, is chosen so that a position of the laser device can be detected using an infrared transmission image
Data Source
AI summary
Provided is a mounting component for an optical fiber that allows a laser device and an optical fiber to be aligned with higher precision while providing protection for the laser device mounted on a substrate. The a mounting component is a component formed from silicon for optically coupling a laser device to an optical fiber by being bonded to a mounting substrate on which the laser device is mounted, and includes a groove portion for fixedly holding the optical fiber so that a core of the optical fiber is positioned at a predetermined depth with respect to a bonding surface to be bonded to the mounting substrate, and a recessed portion, formed continuous with the groove portion, for accommodating the laser device, wherein a thickness of the mounting component, measured in a direction perpendicular to the bonding surface, is chosen so that a position of the laser device can be detected using an infrared transmission image when the laser device is accommodated in the recessed portion by placing the bonding surface in contact with the mounting substrate.