Silicon OLED Heat Dissipation Layer for Panel and FPC Cooling
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Solution Overview
Problem
Current silicon-based OLED display devices lack effective heat dissipation designs, leading to temperature-related issues such as non-uniform display brightness and reduced lifespan, especially in near-eye display applications like VR/AR head-mounted devices.
Innovation Solution
A display device comprising a silicon-based organic light-emitting display panel, a flexible printed circuit board, and a heat dissipation layer integrated on the non-display side of the panel, extending to cover the flexible printed circuit board for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If no heat dissipation design is implemented in silicon-based OLED display devices, then the device structure remains simple and manufacturing cost is low, but temperature-related issues occur leading to non-uniform display brightness and reduced lifespan
Solution Approach 1:
The patent combines the heat dissipation function with the existing packaging structure by integrating the heat dissipation layer into the packaging layer that already covers the light-emitting element layer. This merging approach adds heat dissipation capability without creating a separate complex heat dissipation system, thus improving reliability while minimizing additional structural complexity
Solution Approach 2:
The packaging layer is designed to serve multiple functions: it provides both protective packaging for the light-emitting elements and heat dissipation pathways. By making the packaging layer multi-functional, the patent avoids adding dedicated heat dissipation components, thereby improving thermal management while keeping the overall device structure simple
2Temperature
If a heat dissipation layer is integrated on the non-display side extending to cover the flexible printed circuit board, then heat dissipation effectiveness is improved, but manufacturing process complexity increases
Solution Approach 1:
The heat dissipation layer is segmented into different regions with different extensions: it covers the display panel area and extends partially onto the flexible printed circuit board. This segmentation allows optimized heat dissipation in different zones while maintaining compatibility with existing manufacturing processes for each component
Solution Approach 2:
The heat dissipation layer is integrated into the packaging structure during the manufacturing process, before final assembly. This preliminary integration ensures proper thermal contact and alignment with the light-emitting elements and circuit board, simplifying the overall manufacturing process by combining multiple steps into one
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat, improving display quality, extending the lifespan of the device, and simplifying the manufacturing process while reducing costs.
Implementation Method 1
a heat dissipation layer disposed on a non-display side of the silicon-based organic light-emitting display panel, and extending to the flexible printed circuit board to cover at least a part of the flexible printed circuit board
Data Source
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AI summary
A display device, a heat dissipation layer, an electronic device, and a method for manufacturing a display device are provided. The display device includes: a silicon-based organic light-emitting display panel, including a silicon substrate, a first electrode of a display element, an organic light-emitting layer, and a second electrode of the display element that are stacked sequentially; a flexible printed circuit board electrically connected to the silicon substrate; and a heat dissipation layer on a non-display side of the silicon-based organic light-emitting display panel, extending to the flexible printed circuit board to cover at least a part of the flexible printed circuit board. A gate drive circuit, a data drive circuit, and a pixel circuit are integrated on the silicon substrate, and the flexible printed circuit board is configured to transmit electrical signals to the gate drive circuit, the data drive circuit, and the second electrode of the display element. By adopting the heat dissipation layer, the display device can realize the heat dissipation of the silicon-based organic light-emitting display panel and the flexible printed circuit board, thereby improving the display quality of the display device.