Silicon Optical Module Assembly for Thermal Expansion Mismatch
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Solution Overview
Problem
In optical communication systems, the thermal expansion mismatch between silicon optical chips and circuit boards can lead to instability in optical coupling efficiencies and heat dissipation issues, particularly during high-speed signal transmission, affecting the performance of optical modules.
Innovation Solution
The optical module incorporates a circuit adapter board with a lower thermal expansion coefficient than the circuit board, providing a stable surface for the silicon optical chip and improving heat dissipation using materials like ceramics, and a connector fixing component with a similar thermal expansion coefficient to maintain alignment accuracy of optical fibers and silicon optical chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a silicon optical chip is directly mounted on a circuit board, then the device complexity is reduced, but thermal expansion mismatch causes instability in optical coupling efficiency and heat dissipation issues
Solution Approach 1:
A circuit adapter board is introduced as an intermediary component between the silicon optical chip and the circuit board. This adapter board has a thermal expansion coefficient that matches that of the silicon optical chip, serving as a thermal expansion buffer that absorbs differential expansion stresses and maintains stable optical coupling efficiency while enabling heat dissipation from the chip.
2Reliability
If a circuit adapter board with matched thermal expansion coefficient is introduced, then optical coupling stability is improved, but the device complexity increases
Solution Approach 1:
The circuit adapter board integrates multiple functions into a single component: it serves as both a circuit connection substrate and a thermal expansion buffer. The adapter board combines electrical connection capabilities with thermal management functionality, eliminating the need for separate components and simplifying the overall device structure despite adding a layer.
3Productivity
If high-speed signal transmission is implemented, then productivity is improved, but heat dissipation issues arise due to thermal expansion mismatch
Solution Approach 1:
The circuit adapter board is specifically designed with a thermal expansion coefficient that matches the silicon optical chip. This thermal expansion matching prevents differential thermal stress and deformation during high-speed signal transmission, enabling effective heat dissipation from the chip while maintaining stable optical coupling efficiency under thermal load.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the stability of optical coupling efficiencies and heat dissipation, ensuring reliable high-speed signal transmission by minimizing thermal deformation and maintaining precise alignment between optical components.
Implementation Method 1
A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board
Implementation Method 2
improving heat dissipation using materials like ceramics
Data Source
AI summary
An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.