Silicon Optical Module V-Groove Alignment for Thermal Stability
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Solution Overview
Problem
Existing optical modules with DFB Laser devices and Mach-Zehnder type modulators face challenges in achieving precise optical coupling and high yield rates due to stringent alignment requirements and increased costs associated with complex assembly processes and temperature control, especially in dense wavelength division multiplexing systems.
Innovation Solution
The optical module design features a first and second silicon substrate with V-letter shaped grooves for precise alignment and mounting of a Laser device and optical modulator, respectively, using image-recognition and mechanical positioning control systems, along with a compact collimated or ball lens for efficient light transformation and coupling, and a compensation lens for optical adjustments, reducing the need for complex lens holders and YAG Laser welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If DFB Laser device and Mach-Zehnder type modulator are monolithically integrated, then assembling cost and assembly area are reduced, but wavelength stabilization becomes difficult due to thermal expansion differences
Solution Approach 1:
The patent divides the optical module into separate substrates: the laser device is mounted on a first substrate while the modulator is mounted on a second substrate. This segmentation allows independent thermal management and wavelength stabilization for each component, resolving the thermal expansion conflict while maintaining cost-effectiveness through modular assembly.
Solution Approach 2:
The patent introduces a substrate as an intermediary between the laser device and modulator. This substrate serves as a mounting platform that enables precise positioning and optical alignment while providing thermal isolation, allowing wavelength stabilization without requiring monolithic integration.
2Adaptability or versatility
If EA modulator element is used with band-gap wavelength matching for each communication wavelength, then DWDM system expandability is improved, but development and manufacturing cost increases due to multiple device preparations
Solution Approach 1:
The patent employs a universal mounting substrate that can accommodate different modulator types and configurations. The substrate design with standardized grooves and positioning features allows a single platform to support multiple wavelength configurations, eliminating the need for separate device preparations for each communication wavelength.
3Strength
If YAG Laser welding is used for fixing lenses and components, then strong bonding is achieved, but positioning accuracy deteriorates due to metal condensation during cooling
Solution Approach 1:
The patent performs preliminary positioning of lenses and components in V-letter shaped grooves before final fixation. The grooves are designed to mechanically constrain components in precise positions, and this preliminary positioning is maintained during the bonding process, preventing displacement despite thermal effects of YAG Laser welding.
Solution Approach 2:
The patent introduces V-letter shaped grooves as intermediary structures between the components and the substrate. These grooves provide mechanical positioning and support, acting as a mediator that maintains positioning accuracy while allowing strong bonding through YAG Laser welding of the component holders to the substrate.
4Manufacturing precision
If compensation lens is added for adjusting lens dislocation, then optical coupling accuracy is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent implements preliminary action by designing V-letter shaped grooves with precise dimensions and angles that pre-position lenses and optical components in their correct locations. This preliminary mechanical positioning achieves the required optical coupling accuracy without requiring additional compensation lenses or post-assembly adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the yield rate, reduces manufacturing costs, and simplifies the assembly process while maintaining high reliability and precision, allowing for effective optical coupling and improved modulation characteristics.
Implementation Method 1
a first lens transforming an divergent light emitted from the first optical device into a parallel light
Implementation Method 2
a second lens converging the parallel light to the second optical device
Implementation Method 3
a first V-letter shaped groove formed on a surface of a first silicon substrate, a second V-letter shaped groove formed on a surface of a second silicon substrate
Data Source
AI summary
An optical module includes a first silicon substrate having a first groove at its surface, a second silicon substrate having a second groove at its surface, a Laser device formed on the first silicon substrate, an optical modulator formed on the second silicon substrate, a substrate on which the first and the second silicon substrates are mounted wherein an optical axis of the Laser device is matched up with an optical axis of the optical modulator, a first lens transforming an divergent light emitted from the first optical device into a parallel light, disposed in the first groove, and a second lens converging the parallel light to the second optical device, disposed in the first groove.