Silicon Optical Ports Passive Alignment Connectors
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Solution Overview
Problem
High-bandwidth optical communication systems face challenges in maintaining proper alignment between silicon-based laser devices and optical connectors, leading to increased costs and reduced throughput due to the need for expensive and time-consuming active alignment processes.
Innovation Solution
The implementation of optical ports that utilize passive alignment, establishing vertical reference datums and mechanical features for horizontal axis control to align photonic silicon chip waveguides with connector alignment features, eliminating the need for active alignment systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment processes are used to align waveguides with optical connectors, then alignment precision is improved, but manufacturing cost and time consumption increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-establishing vertical reference datums on the substrate and designing mechanical features (ridges, grooves, spheres, sockets) that provide horizontal axis control before the actual alignment process. This pre-positioning of reference features eliminates the need for time-consuming active alignment during assembly, as components self-align through the predetermined mechanical structures.
Solution Approach 2:
The patent replaces the optical/mechanical active alignment system with a passive mechanical feature-based alignment system. Instead of using vision-based active alignment processes, the invention uses purely mechanical features (ridges fitting into grooves, spheres fitting into sockets) to achieve precise alignment, substituting complex active alignment machinery with simple passive mechanical structures.
2Manufacturing precision
If active alignment systems are used to mate optical connectors, then alignment accuracy is improved, but device complexity and cost increase
Solution Approach 1:
The patent extracts and removes the need for active alignment systems entirely from the alignment process. By incorporating alignment features directly into the substrate and connector structures, the invention eliminates the separate active alignment system, reducing device complexity while maintaining alignment accuracy through the built-in mechanical features.
Solution Approach 2:
The alignment features (ridges, grooves, spheres, sockets) are designed to automatically guide and position components relative to each other during assembly. The mechanical features self-align the waveguides with the optical connector without requiring external active alignment equipment, making the system self-aligning and reducing overall complexity.
3Adaptability or versatility
If silicon-based laser devices with side facet emission are used, then device integration is improved, but alignment difficulty increases due to lack of turning
Solution Approach 1:
The patent introduces mechanical intermediary features (ridges, grooves, spheres, sockets) that mediate between the side facet emitting waveguides and the optical connector. These intermediary mechanical features provide the necessary alignment interface, allowing direct coupling without optical turning while maintaining precise alignment through the mechanical guidance structures.
Data Source
AI summary
Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.


