Silicon Optical Scanner Stray Light Suppression Layer

The invention applies preliminary action by forming the non-reflection film with specific spacing from the edges before the etching process. This pre-positioning of the film ensures that after etching, the film automatically covers only the necessary areas (not on the edges that will become exposed side surfaces), thereby eliminating the need for subsequent planarization and corner rounding steps. The film is strategically placed in advance to achieve both stress prevention and manufacturing efficiency.

The invention extracts the non-reflection film from covering the entire surface and instead positions it only on specific areas away from the edges. By removing the film from the edge regions that will be exposed after etching, the patent eliminates the harmful effects (stress concentration) while maintaining the beneficial effects (stray light suppression) in the appropriate areas. This selective extraction resolves the contradiction by avoiding unnecessary processing steps.

The invention converts the harmful effect of scallop irregularities into a beneficial outcome by using the non-reflection film strategically. Instead of trying to eliminate the scallops through additional processing, the patent accepts the dry etching scallops but prevents them from causing stress concentration by ensuring the film does not cover the exposed side surfaces. The film is positioned to cover only the top surfaces where stray light suppression is needed, while leaving the side surfaces exposed. This transforms the previously harmful scallop effect into a non-problematic feature.

The invention applies local quality by providing the non-reflection film only in specific locations (on the top surfaces away from edges) rather than uniformly across all surfaces. This localized application ensures that the film suppresses stray light where needed while avoiding coverage of the side surfaces where scallop irregularities would cause stress concentration. The selective positioning of the film creates different functional qualities in different areas of the same component.

The invention converts the harmful corner effects from wet etching into a non-problematic feature by using the non-reflection film strategically positioned away from edges. The corners formed by silicon crystal planes at the interfaces are accepted as inevitable, but the film positioning ensures these corners are not covered by the film, preventing stress concentration at the film-interface boundaries. The harmful corner effect is transformed into a benign feature by changing where the film is applied.

The invention applies local quality by creating different functional zones: the non-reflection film covers areas where stray light suppression is needed, while deliberately leaving the interface corner regions exposed. This localized differentiation allows wet etching to create its characteristic corners without causing stress concentration, as the film is not present at these vulnerable locations. Each area of the component has the appropriate property for its functional requirement.

The invention applies local quality by creating spatially differentiated functionality: the non-reflection film is positioned to cover only the areas where stray light suppression is required (the top surfaces of the beams away from edges), while deliberately leaving the edge regions and side surfaces exposed. This localized application creates optimal performance in each region - stray light suppression where light interacts with the beam tops, and stress resistance where the edges are exposed and can remain free of stress-concentrating film coverage.

The invention segments the beam surface into functionally distinct zones: covered areas (top surfaces away from edges) for stray light suppression and uncovered areas (edges and side surfaces) for mechanical strength. By dividing the surface coverage into these separate functional segments, the patent achieves both objectives simultaneously - the segmented film coverage suppresses stray light in appropriate areas while leaving stress-sensitive edge regions free of film-induced stress concentration.