3D Optoelectronic Packaging with Silicon Optical Vias
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Solution Overview
Problem
Current optical transceivers used in computers and integrated circuits are bulky and expensive, limiting their performance and cost-effectiveness, especially as communication distances and frequencies increase.
Innovation Solution
An optoelectronic assembly featuring a silicon layer with optical vias and a microlens-based optical coupling layer, integrated with VCSELs or photodiodes, and a carrier interposer for thermal management, enabling compact and cost-effective packaging of optical transceivers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional optical transceivers are used for high-speed communication over long distances, then communication performance is improved, but device size and cost increase significantly
Solution Approach 1:
The patent merges multiple optical components (VCSELs, photodiodes, microlenses, waveguides) onto a single silicon substrate, creating an integrated optoelectronic transceiver. This consolidation eliminates the need for separate discrete components, dramatically reducing overall device volume while maintaining high-speed communication capabilities through direct optical coupling between integrated elements
Solution Approach 2:
The patent employs three-dimensional stacking of optical layers above and below the silicon substrate, with optical vias penetrating through the substrate to connect VCSELs on one side with photodiodes on the other. This vertical integration approach充分利用s the third dimension to pack more functionality into a smaller footprint, reducing the transceiver's planar area while enabling full-duplex optical communication
2Speed
If traditional optical transceivers are used for high-speed communication over long distances, then communication performance is improved, but device cost increases significantly
Solution Approach 1:
The silicon substrate serves multiple functions simultaneously: as a mechanical support structure, as an electrical interconnection layer through copper traces, as an optical waveguide medium, and as a platform for integrating active optoelectronic components. This multi-functionality eliminates the need for separate substrates and interconnection structures, reducing manufacturing steps and material costs while enabling high-speed optical communication
Solution Approach 2:
The patent changes the operating wavelength to 1550 nm where silicon has low optical absorption, enabling light to propagate through the silicon substrate itself as a waveguide. This parameter change allows the substrate to serve dual purposes as both structural support and optical transmission medium, eliminating the need for separate optical waveguide structures and reducing overall device complexity and cost
3Volume of moving object
If electrical data links are used for communication, then device size is reduced, but communication distance and speed are limited
Solution Approach 1:
The patent replaces electrical signal transmission through copper interconnects with optical signal transmission through silicon waveguides and free-space optical paths. This substitution eliminates the fundamental bandwidth and distance limitations of electrical links while maintaining compact form factor, as optical signals can traverse longer distances with lower attenuation and higher bandwidth capacity
4Volume of moving object
If optical components are integrated onto silicon substrate, then device size is reduced, but thermal management becomes more challenging
Solution Approach 1:
The patent introduces thermal vias and heat sink structures integrated into the silicon substrate to serve as thermal pathways. These thermal management features act as intermediaries that conduct heat away from the high-power VCSEL and photodiode components through the substrate to external heat sinks, enabling effective thermal dissipation in the compact integrated structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the size and cost of optical transceivers while maintaining high-speed communication capabilities over long distances, improving component density and manufacturing efficiency through wafer-scale packaging and 3D stacking.
Implementation Method 1
An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via
Implementation Method 2
The first OE element includes a vertical cavity surface emitting lasers (VCSEL)
Implementation Method 3
The first OE element includes a vertical cavity surface emitting lasers (VCSEL) and/or a photodiode (PD) array
Implementation Method 4
The assembly may further include a heat spreader between the first OE element and the carrier
Data Source
AI summary
An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.