Silicon Oxide Barrier Layer Adhesion in Flexible Displays
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Solution Overview
Problem
Display devices face challenges in improving the adhesion force of barrier layers and reducing optical afterimages, particularly due to low adhesive properties between organic and inorganic materials, leading to potential lifting of polyimide substrates and charge trapping issues.
Innovation Solution
A display device is designed with a first barrier layer made of silicon oxide, formed using a specific ratio of SiH4 to N2O gases, which increases hydrogen content and adhesion force, and a dielectric constant range of 4 to 6, enhancing dipole-dipole interactions and mechanical anchoring between polyimide substrates, thereby improving adhesion and reducing optical afterimages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional barrier layer is used between polyimide substrates, then the device structure is simple, but the adhesion force between substrates is insufficient causing substrate lifting
Solution Approach 1:
The patent changes the chemical composition parameters of the barrier layer by incorporating specific ratios of silicon oxide (SiO2), silicon nitride (Si3N4), and silicon oxynitride (SiOxNy). This compositional parameter change enhances the adhesion force between polyimide substrates through improved chemical bonding and dipole interactions, while maintaining a relatively simple single-layer barrier structure that does not significantly increase device complexity.
Solution Approach 2:
The patent employs a composite barrier layer material system combining silicon oxide, silicon nitride, and silicon oxynitride. This composite material approach leverages the complementary properties of each component: silicon oxide for adhesion enhancement through hydrogen bonding, silicon nitride for mechanical strength and barrier properties, and silicon oxynitride for balanced electrical and mechanical characteristics. The composite material strategy achieves superior adhesion force without requiring complex multi-layer structures.
2Object-affected harmful factors
If the dielectric constant of the barrier layer is increased to reduce optical afterimages, then charge trapping is reduced, but the adhesion force may be compromised
Solution Approach 1:
The patent optimizes the dielectric constant parameter of the barrier layer by controlling the compositional ratios of silicon oxide, silicon nitride, and silicon oxynitride. The silicon nitride component contributes to higher dielectric constant values that reduce charge trapping and optical afterimages, while the silicon oxide component maintains adhesion through hydrogen bonding. By adjusting the proportion parameters of these materials, the patent achieves a balanced dielectric constant that simultaneously addresses both optical afterimage reduction and adhesion force requirements.
Solution Approach 2:
The composite barrier layer material system enables independent optimization of adhesion and dielectric properties. Silicon nitride provides high dielectric constant for reducing charge trapping and optical afterimages, while silicon oxide provides strong adhesion to polyimide substrates through hydrogen bonding. This composite material approach allows the patent to achieve both low optical afterimages and high adhesion force by leveraging the complementary functional properties of different materials within the same barrier layer.
3Strength
If the barrier layer is made purely of inorganic material, then mechanical strength is high, but adhesion to organic polyimide substrates is poor
Solution Approach 1:
The patent modifies the chemical composition parameters of the inorganic barrier layer by incorporating silicon oxide components that can form hydrogen bonds with the organic polyimide substrates. This compositional parameter change creates chemical interaction pathways between inorganic and organic materials, significantly improving interfacial adhesion. The silicon oxide's ability to form hydrogen bonds bridges the chemical compatibility gap between inorganic barrier layer and organic polyimide, while maintaining the overall structural stability of the device.
Solution Approach 2:
Silicon oxide acts as an intermediary material within the barrier layer that facilitates adhesion between inorganic and organic components. The silicon oxide component provides hydrogen bonding capability that mediates the interaction between the inorganic barrier layer structure and the organic polyimide substrates. This intermediary function of silicon oxide resolves the material compatibility issue by creating a chemical bridge that enhances adhesion while maintaining the distinct properties of both inorganic and organic materials in the device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases the adhesion force between substrates and reduces optical afterimages by enhancing the adhesion properties and dielectric constants, leading to improved flexible display performance and reduced charge trapping.
Implementation Method 1
enhancing dipole-dipole interactions and mechanical anchoring between polyimide substrates, thereby improving adhesion
Implementation Method 2
enhancing dipole-dipole interactions and mechanical anchoring between polyimide substrates
Implementation Method 3
a dielectric constant range of 4 to 6, enhancing dipole-dipole interactions and mechanical anchoring
Data Source
AI summary
A display device and a method of manufacturing the same are provided. The display device, comprises a first base substrate, a first barrier layer disposed on the first base substrate, a second base substrate disposed on the first barrier layer, at least one transistor disposed on the second base substrate, and an organic light emitting diode disposed on the at least one transistor, wherein the first barrier layer includes a silicon oxide, and has an adhesion force of 200 gf/inch or more to the second base substrate.