Silicon Oxide Cooling Manifold with Interlaced Channels
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Solution Overview
Problem
Conventional heat sinks are inadequate for managing the increased heat flux generated by power electronics and integrated circuit devices, especially in compact and variable arrangements, necessitating more scalable and configurable cooling solutions.
Innovation Solution
A cooler device featuring a silicon-based manifold with interlaced inlet and outlet channels, where each outlet channel has a larger depth than the inlet channels, and is encapsulated within a manifold case for enhanced cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat sinks are used, then the structure is simple and easy to manufacture, but they are inadequate for managing increased heat flux from power electronics devices
Solution Approach 1:
The heat sink is segmented into multiple independent cooling channels within the manifold, allowing each channel to handle specific heat loads. This segmentation enables the system to manage higher total heat flux while maintaining a relatively simple overall structure that can be manufactured using conventional techniques.
Solution Approach 2:
The patent introduces vertical depth variation in the cooling channels, creating a three-dimensional cooling structure. The outlet channels have greater depth than inlet channels, adding a vertical dimension to heat removal that significantly increases heat flux management capability without proportionally increasing horizontal footprint or manufacturing complexity.
2Power
If power electronics devices are designed to operate at increased power levels, then the processing capability increases, but the heat flux generated increases requiring more advanced cooling
Solution Approach 1:
The cooling manifold is designed with non-uniform channel depths where outlet channels have greater depth than inlet channels. This local variation in channel geometry optimizes heat removal at different locations within the manifold, allowing the system to handle increased heat flux from high-power devices by providing enhanced cooling capacity where most needed.
Solution Approach 2:
The patent changes the geometric parameters of the cooling channels, specifically varying the depth parameter along the flow path. By increasing the depth of outlet channels relative to inlet channels, the system increases its heat removal capacity to match the higher heat flux generated by increased power levels, while maintaining compatibility with existing device form factors.
3Adaptability or versatility
If cooling assemblies are made more configurable and scalable, then they can accommodate compact and variable arrangements, but the device complexity increases
Solution Approach 1:
The manifold design serves multiple functions: it distributes coolant to multiple cooling channels, provides thermal management for high heat flux, and enables scalable configurations for different device arrangements. This multi-functionality allows a single component to address various cooling requirements without proportionally increasing overall system complexity.
Solution Approach 2:
The cooling channels are nested within the manifold structure with varying depths, creating a compact three-dimensional arrangement. This nesting approach allows the cooling assembly to be scaled and configured for different device layouts while maintaining a compact form factor, as the channels are efficiently packed within the available volume rather than requiring extensive horizontal space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooler device achieves improved cooling capabilities by reducing coolant pressure drop and facilitating shorter travel paths, thereby effectively managing high heat flux in compact and variable arrangements.
Implementation Method 1
The fluid may further remove heat through latent heat of vaporization as it changes phase from a liquid to vapor
Implementation Method 2
A liquid coolant, such as a cooling fluid, may be introduced to the heat management device, where it receives heat from the heat management device, primarily through convective and/or conductive heat transfer
Implementation Method 3
The fluid may further remove heat through latent heat of vaporization as it changes phase from a liquid to vapor
Implementation Method 4
The fluid may further remove heat through latent heat of vaporization as it changes phase from a liquid to vapor
Data Source
AI summary
Disclosed herein are apparatus for a cooler device includes a manifold constructed at least partially of silicon oxide. The manifold includes an array of inlet channels and an array of outlet channels. Each inlet channel has a first depth. The array of outlet channels are interlaced with the array of inlet channels, Each outlet channel has a second depth that is larger than the first depth. Each of the array of outlet channels has a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels.