Silicon Oxide Capacitor Dielectric for High-Q Matching Circuits

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Semiconductor devices, particularly capacitors used in matching and filtering circuits, face challenges in achieving high Q-value characteristics due to insufficient research on dielectric films that enhance this parameter.

Innovation Solution

A semiconductor device is designed with a dielectric film made of silicon oxide, where the ratio of three-membered ring structures to four-membered ring structures is 0.46 or less, and includes a substrate, first and second electrode layers, a moisture-resistant film, and protective layers to improve Q-value characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional dielectric materials are used in capacitors, then the capacitor can be manufactured with standard materials, but the Q-value is insufficient for high-performance matching and filtering circuits

Engineering Contradiction:
ImproveQ-valueVSAvoiddielectric film selection
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the chemical composition parameters of the dielectric film by specifying exact ratios of metal oxides (SiO2: 50-70 wt%, B2O3: 10-30 wt%, Al2O3: 5-20 wt%) to achieve the desired Q-value characteristics while maintaining manufacturability with conventional ceramic processing techniques

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite dielectric material by combining multiple metal oxides (silicon oxide, boron oxide, aluminum oxide) in specific proportions to achieve synergistic effects that improve Q-value beyond what single materials can provide, while still using standard manufacturing processes

Inventive Principle:
Principle #40Composite materials

2Loss of energy

If high-Q dielectric materials are developed, then the Q-value and power efficiency improve, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvedielectric lossVSAvoiddielectric film composition
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent optimizes the compositional parameters within practical manufacturing ranges (SiO2: 50-70 wt%, B2O3: 10-30 wt%, Al2O3: 5-20 wt%) to minimize dielectric loss while ensuring the material can be processed using conventional ceramic fabrication methods, avoiding excessive complexity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent focuses the compositional optimization specifically on the dielectric film layer where it is most needed for Q-value improvement, while keeping other capacitor components and manufacturing steps relatively simple and conventional

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The semiconductor device achieves high Q-value characteristics, reducing dielectric loss and power consumption in matching and filtering circuits, with significant improvement when the ratio of three-membered rings to four-membered rings is less than 0.44, leading to enhanced performance and efficiency.

Implementation Method 1

a dielectric film on the first electrode layer, the dielectric film containing silicon oxide, and a ratio of three-membered ring structures to four-membered ring structures in the silicon oxide is 0.46 or less

Methodology Applied
Scientific EffectDielectric loss reduction through molecular structure control: Dielectric

Data Source

PatentUS20240304660A1Semiconductor device, matching circuit, and filtering circuit
Publication Date: 2024.09.12 MURATA MFG CO LTD
  • US20240304660A1 patent drawing
  • US20240304660A1 patent drawing
  • US20240304660A1 patent drawing

AI summary

A semiconductor device that includes a substrate; a first electrode layer on the substrate; a dielectric film on the first electrode layer, the dielectric film containing silicon oxide, and a ratio of three-membered ring structures to four-membered ring structures in the silicon oxide is 0.46 or less; a second electrode layer on the dielectric film; a protective layer covering the first electrode layer and the second electrode layer, and outer electrodes piercing the protective layer.