Silicon Heat-Dissipation Package for Compact Device Cooling
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Solution Overview
Problem
Compact electronic devices face challenges in heat dissipation due to their small form factor, making it impractical to use large metal heat sinks effectively.
Innovation Solution
A silicon heat-dissipation package is designed, where a compact electronic device is sandwiched between silicon cover plates with integrated heat sinks and collimation elements, utilizing thermal conduction and convection to manage heat, and includes metallic patterns for electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large metal heat sinks are used, then heat dissipation efficiency is improved, but device form factor increases
Solution Approach 1:
The patent merges the heat sink function directly into the silicon cover plate by integrating heat dissipation fins and thermal conduction pathways into the packaging structure itself. This combination eliminates the need for separate large metal heat sinks while achieving effective heat dissipation within a compact form factor.
Solution Approach 2:
The invention applies high thermal conductivity materials and optimized fin structures specifically at the heat-generating regions of the electronic device. The heat sink features are locally concentrated where thermal management is most critical, maximizing heat dissipation efficiency without requiring a large overall structure.
2Volume of moving object
If compact packaging is used, then device size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by incorporating vertical heat dissipation pathways, stacked heat sink fins, and multi-layer thermal conduction structures. This dimensional approach enables effective heat dissipation within a compact volume by utilizing the third dimension for thermal management.
Solution Approach 2:
The invention employs composite structures combining silicon cover plates with integrated heat dissipation features, potentially incorporating multiple materials with different thermal properties. The composite design optimizes both mechanical support and thermal management functions within the compact packaging structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution efficiently transfers heat from the electronic device to the ambient air, enhancing heat dissipation and maintaining device performance and lifespan by leveraging precision-made silicon components and semiconductor fabrication processes.
Implementation Method 1
utilizing thermal conduction and convection to manage heat
Implementation Method 2
utilizing thermal conduction and convection to manage heat
Data Source
AI summary
Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.