Silicon Package with Embedded Antenna Cavities for mm-Wave Signal Routing
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Solution Overview
Problem
Current mm-wave radar chipsets at 77 GHz and above face high noise figures due to dielectric and interconnect losses, requiring expensive low-loss PCB substrates and are limited in frequency range, with embedded wafer level ball grid array (eWLB) technology leading to scattering and diffraction issues, and limited antenna integration capabilities.
Innovation Solution
A silicon-based packaging solution with a carrier structure, multiple polymer layers, and metallization layers for low-loss interconnections, along with a cover structure that includes cavities and antenna elements or waveguides, reduces noise and increases repeatability, allowing for high-frequency operation with reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If eWLB surface mount technology is used for soldering on PCB, then the package can be manufactured with standard processes, but dielectric losses and interconnect losses are very high at mm-wave frequencies resulting in increased noise figure
Solution Approach 1:
The patent extracts the RF signal path from the lossy PCB environment and routes it entirely within the silicon package through low-loss interconnect structures. The antenna is integrated directly into the package, eliminating the need for external PCB transmission lines and reducing exposure to high-loss dielectric materials.
Solution Approach 2:
The patent introduces a specialized silicon package structure with controlled impedance interconnects as an intermediary between the IC and antenna. This package acts as a low-loss transmission medium that bridges the gap between the IC output and the antenna input, avoiding the high-loss PCB path.
2Adaptability or versatility
If planar antenna is used on redistribution layer with metal ground plane on PCB, then antenna integration is achieved, but scattering and diffraction occur due to polymer mold mass and package edges causing ripples in antenna pattern
Solution Approach 1:
The patent nests the antenna structure within a cavity in the silicon package, placing it inside a defined electromagnetic environment. This nested configuration allows precise control of the antenna's electromagnetic field and isolates it from external scattering objects.
Solution Approach 2:
The patent applies different material properties and structural characteristics to different regions: the cavity region provides electromagnetic isolation, the silicon package provides mechanical support and electrical grounding, and the antenna region provides radiation functionality. Each region is optimized for its specific function to minimize interference.
3Ease of manufacture
If eWLB package size is limited, then manufacturing costs are controlled, but the number of mm-wave channels is limited to max. 4 antennas
Solution Approach 1:
The patent transitions from planar antenna arrangements to three-dimensional cavity-based antenna structures. By utilizing the vertical dimension and creating multiple antenna elements within the package volume rather than just on the surface, the system can accommodate more antenna channels within the same footprint.
Solution Approach 2:
The patent nests multiple antenna elements and interconnect structures within the package volume, allowing multiple functional elements to coexist in a compact arrangement that maximizes the use of available space while maintaining electrical performance.
4Ease of manufacture
If eWLB technology is used, then standard surface mount processes can be employed, but it is almost impossible to shield electronic components or edges of mold mass from radiation of omnidirectional antenna in low-cost manner
Solution Approach 1:
The patent nests the antenna within a cavity structure that provides inherent electromagnetic shielding. The cavity walls and package structure act as a shield, containing the electromagnetic fields and preventing interference with other components without requiring additional expensive shielding materials or complex arrangements.
Data Source
AI summary
A package for embedding one or more electronic components comprises a carrier structure a silicon-based carrier layer, one or more electronic components embedded in one or more cavities formed in the carrier layer, and a cover structure arranged on top of the carrier structure. The cover structure comprises a cover layer and one or more cavities formed in the cover layer. An antenna element and/or a waveguide for connection to an antenna element is formed in and/or on top of the cover layer and coupled to the one or more cavities.