Silicon Package Unit With Through Electrodes For Hermetic Sealing
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Solution Overview
Problem
Existing electronic component devices face challenges in achieving high productivity and miniaturization due to complex manufacturing processes and increased costs, as well as limitations in satisfying miniaturization demands, particularly with wire connections between components.
Innovation Solution
The solution involves a silicon package unit with through electrodes and upright electrode posts on a silicon substrate, where electronic components are directly connected to the posts, and a cap package unit is joined to form a hermetically sealed housing, allowing for assembly at the wafer level and reducing the need for wire connections, thereby improving efficiency and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the upper ceramic base is joined to the frame-shaped ceramic portion after the electronic component is mounted on the unit piece package, then the package can be hermetically sealed, but the manufacturing process becomes complex and productivity decreases
Solution Approach 1:
The patent applies preliminary action by pre-joining the upper and lower ceramic bases to form a complete housing portion before mounting the electronic component. This reverses the conventional sequence where the housing is assembled after component mounting, thereby enabling more efficient subsequent processing and improved productivity while maintaining hermetic sealing capability.
2Reliability
If wire connections are used between the driver IC and the electrode on the lower ceramic base, then electrical connection is achieved, but the device area increases and miniaturization cannot be satisfied
Solution Approach 1:
The patent extracts and eliminates the wire connection from the system by implementing direct electrical connection between the driver IC and the electrode through the ceramic base structure. This removes the need for separate wire interconnects, thereby reducing the device area and enabling miniaturization while maintaining reliable electrical connection.
Solution Approach 2:
The patent merges the electrical connection function with the structural ceramic base by integrating conductive pathways directly into the ceramic base design. This combines the functions of structural support and electrical interconnection, eliminating the need for separate wire connections and reducing overall device area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of smaller electronic component devices with enhanced reliability by suppressing thermal stress and improving production efficiency, while reducing manufacturing costs and achieving miniaturization.
Implementation Method 1
a housing portion S is constructed by fixing an upper ceramic base 400 onto the frame-shaped ceramic portion 250 by Au—Sn bonding
Data Source
AI summary
An electronic component device of the present invention includes: a silicon package unit having a structure in which a through electrode provided to a silicon substrate while an electrode post connected to the through electrode is provided upright on an upper side of the silicon substrate; an electronic component mounted on the electrode post and having a connection terminal connected to the top end of the electrode post; and a cap package unit joined onto a periphery of the silicon package unit, and constructing a housing portion in which the electronic component is housed to be hermetically sealed.