Silicon Photonic Distance Sensor for Wide-Angle Scanning
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Solution Overview
Problem
Existing LIDAR distance measuring sensors face challenges in miniaturization and wide-angle scanning due to the physical size enlargement required for multiple light sources or branched optical fibers, leading to increased manufacturing costs.
Innovation Solution
A distance measuring sensor configuration utilizing a semiconductor optical amplifier and resonator with a silicon photonic circuit on a single semiconductor substrate, allowing for multiple light beams to be emitted in different directions without enlarging the physical size, enabling wider-angle scanning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If two light sources with optical fibers are prepared to emit lights in different directions, then the illumination region scanned can be widened, but the physical size of the optical system has to be enlarged
Solution Approach 1:
The patent merges multiple light sources and their optical paths onto a single semiconductor substrate. The first and second light sources, along with their respective optical fibers for emitting light in different directions, are integrated on the same substrate, eliminating the need for separate mounting spaces and reducing the overall physical size of the optical system while maintaining the ability to scan a wide illumination region.
Solution Approach 2:
The patent transitions from a three-dimensional arrangement of separate light sources to a two-dimensional planar integration on a semiconductor substrate. By laying out the optical paths and light sources in a planar configuration on the substrate surface, the system achieves wide-angle scanning capability without requiring additional vertical or lateral space that would be needed for discrete component mounting.
2Area of stationary object
If two light sources with optical fibers are prepared to emit lights in different directions, then the illumination region scanned can be widened, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple light sources, optical fibers, and scanning mechanisms into a single integrated semiconductor device. This merging of components into one monolithic structure simplifies the manufacturing process by enabling batch fabrication techniques, reducing assembly steps, and eliminating the need for precise alignment and bonding of separate components, thereby reducing manufacturing cost despite the enhanced scanning capability.
Solution Approach 2:
The semiconductor substrate serves multiple functions simultaneously: it acts as the mounting platform for light sources, the waveguide for light transmission, the scanner for directional control, and the structural base for the entire optical system. This multi-functionality reduces the total component count and simplifies manufacturing, making the production of wide-angle scanning LIDAR more cost-effective.
3Area of stationary object
If a fiber for transmitting light from the light source is branched to different parts to irradiate the mirror with respective lights emitted in two different directions, then the illumination region scanned can be widened, but the physical size of the optical system has to be enlarged
Solution Approach 1:
The patent uses planar waveguides etched into the semiconductor substrate to replace traditional three-dimensional optical fiber branching. The waveguides are formed as two-dimensional conductive paths on the substrate surface, allowing light to be directed to different regions in a planar configuration that minimizes the physical footprint of the optical system while achieving wide illumination coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the physical size of the sensor while allowing for wider-angle scanning, improving manufacturing efficiency and reducing costs by integrating components on a single substrate.
Implementation Method 1
a semiconductor optical amplifier at a semiconductor substrate
Implementation Method 2
a resonator with a silicon photonic circuit at the semiconductor substrate
Implementation Method 3
enabling the light beam emitted from the light source to be reflected at a mirror and vibrating the mirror
Data Source
AI summary
A distance measuring sensor includes: a light source having a semiconductor optical amplifier and a resonator with a silicon photonic circuit, which are at a semiconductor substrate; a plurality of emitters, each emitter configured to emit a light beam generated by the light source to outside of the light source; a scanner configured to perform scanning with the light beam by enabling the light beam emitted from the light source to be reflected at a mirror and vibrating the mirror; an optical receiver configured to receive a reflected light beam, which is generated by the light beam reflected at the object; and a processor configured to measure the distance to the object based on the reflected light beam received at the optical receiver. Light beams respectively emitted from the emitters are incident on the mirror in different directions. The scanner performs scanning different regions with the respective light beams.