Silicon Photonics Built-In Self-Test Block

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Solution Overview

Problem

Current data communication systems are inadequate for handling the high bandwidth demands of modern internet and mobile applications, particularly due to limitations in electrical components that cause inter-symbol interference and are not scalable beyond Moore's Law, necessitating improved methods for data transfer.

Innovation Solution

The development of a high-speed electrical optics multiple chip module integrated on a single silicon substrate, utilizing silicon photonics to enhance data transfer rates by integrating optical devices close to electrical components, including a Serializer/Deserializer block, clock data recovery block, and signal processing blocks, to achieve terabits per second speeds.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electrical components are used for data transfer, then data communication can be achieved, but inter-symbol interference occurs and bandwidth is limited due to electrical bandwidth constraints

Engineering Contradiction:

Improvedata transfer reliabilityVSAvoiddata transfer bandwidth

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent replaces electrical signal transmission with optical signal transmission by integrating silicon photonics devices with electrical components. Optical signals do not suffer from inter-symbol interference and electrical bandwidth limitations, thereby resolving the contradiction between reliable data transfer and high bandwidth capability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent creates a hybrid system combining electrical components (for signal processing and control) with optical components (for high-bandwidth data transmission). This composite approach leverages the strengths of both domains: electrical components provide reliable processing while optical components deliver high bandwidth without interference.

Inventive Principle:

Principle #40Composite materials

2Reliability

If electrical components are placed closer together to reduce inter-symbol interference, then signal quality improves, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvesignal qualityVSAvoiddevice structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent substitutes optical transmission for electrical transmission, eliminating the need to minimize physical distances between electrical components to reduce inter-symbol interference. Optical signals can travel longer distances without degradation, allowing greater design flexibility and reducing device complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If standard CMOS silicon transistors continue to scale according to Moore's Law, then processing capability improves, but scaling stops around 5 nm and bandwidth increases plateau

Engineering Contradiction:

Improveprocessing capabilityVSAvoidscalability beyond 5 nm

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent replaces continued reliance on electrical component scaling with optical transmission technology. By using silicon photonics, the system can achieve terabit per second bandwidth without being constrained by CMOS scaling limits at 5 nm, providing a new dimension for performance improvement independent of transistor miniaturization.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Productivity

If optical devices are integrated close to electrical devices using silicon photonics, then data transfer speed increases to terabits per second, but manufacturing precision requirements increase

Engineering Contradiction:

Improvedata transfer speedVSAvoidintegration precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent merges electrical and optical devices onto a single substrate using silicon photonics technology. This integration allows high-speed data transfer while utilizing established semiconductor manufacturing processes, thereby managing manufacturing precision requirements through proven fabrication techniques rather than requiring entirely new manufacturing capabilities.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient high-bandwidth data transfer beyond traditional electrical limitations, supporting large data sharing among servers in spine-leaf network architectures, addressing the inadequacies of existing systems by leveraging silicon photonics for improved performance.

Implementation Method 1

Silicon photonics is an important technology for moving optics closer to silicon. In this patent application, we will disclose a high speed electrical optics multiple chip module device to achieve terabits per second speed

Methodology Applied

Scientific EffectElectro-optic conversion: Electro-Optic Effects

Data Source

PatentUS9006740B1Built-in self test for silicon photonics device

Publication Date: 2015.04.14 MARVELL ASIA PTE LTD

AI summary

In an example, the present invention includes an integrated system on chip device. The device has a self test block configured on the silicon photonics device and to be operable during a test operation, the self test block comprising a broad band source configured to emit electromagnetic radiation from 1200 nm to 1400 nm or 1500 to 1600 nm to a multiplexer device. In an example, a self test output is configured to a spectrum analyzer device external to the silicon photonics device.