Silicon Photonics LIDAR Grating Coupler Antenna
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Solution Overview
Problem
Existing LIDAR systems face challenges with coupling efficiency, wavelength sensitivity, reliability, and link budget performance due to the limitations of components such as modulators, optical filters, and photodiodes on CMOS-compatible silicon photonics chips.
Innovation Solution
A silicon photonics device for LIDAR is developed, featuring a substrate with a one-dimensional grating coupler antenna and a photodiode coupled to the antenna. The device includes specific structural elements like dielectric and metal layers, and a method for fabrication that involves multiple layers and etching processes to enhance performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional components are used on CMOS-compatible silicon photonics chips, then manufacturing compatibility is improved, but coupling efficiency deteriorates
Solution Approach 1:
The device is segmented into distinct functional layers: a silicon photonics chip layer for CMOS-compatible component integration, and a separate antenna structure layer with one-dimensional grating couplers. This segmentation allows each layer to be optimized independently - the silicon chip for manufacturing compatibility and the antenna structures for coupling efficiency, while maintaining overall system integration.
2Ease of manufacture
If conventional components are used on CMOS-compatible silicon photonics chips, then manufacturing compatibility is improved, but wavelength sensitivity deteriorates
Solution Approach 1:
The one-dimensional grating coupler antennas are designed with specific local geometric properties (grating period, depth, and orientation) that are locally optimized for wavelength-sensitive applications. The grating structures are positioned at specific locations on the silicon chip where wavelength discrimination is most critical, allowing local optimization of optical properties while maintaining overall CMOS compatibility.
3Ease of manufacture
If conventional components are used on CMOS-compatible silicon photonics chips, then manufacturing compatibility is improved, but link budget performance deteriorates
Solution Approach 1:
The invention merges the silicon photonics chip components with one-dimensional grating coupler antenna structures to create an integrated system. This merging reduces optical coupling losses at interfaces between separate components, improves overall system efficiency, and achieves better link budget performance while maintaining CMOS manufacturing compatibility through the unified integration approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silicon photonics device improves coupling efficiency and wavelength sensitivity, enhances reliability, and optimizes link budget performance, addressing the limitations of existing LIDAR systems.
Implementation Method 1
The antenna is a one-dimensional grating coupler. The antenna includes a first grating structure coupled to the substrate
Implementation Method 2
a photodiode formed on the substrate member and coupled to the antenna
Data Source
AI summary
A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.