Silicon Photonics Package Step Difference Control
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Solution Overview
Problem
Current optical device packages face challenges in controlling step differences between silicon photonics devices and high-speed signal processing devices, optimizing heat transfer, and enhancing optical system fixing and adhering capabilities, particularly in high-precision packaging requirements.
Innovation Solution
A package for silicon photonics devices is designed with a step difference control part and a body part that transfers heat, featuring a silicon-based semiconductor process and optical coupling block support, allowing for 3D space internalization and precise inter-chip step difference optimization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a silicon photonics device is mounted on a board with high-speed signal processing devices, then optical signal transmission capability is improved, but step difference between devices increases causing packaging precision degradation
Solution Approach 1:
A step difference control part is introduced as an intermediary component between the silicon photonics device platform and the board. This control part has a first surface that contacts the silicon photonics device platform and a second surface that contacts the board, specifically designed to compensate for and control the step difference caused by different device heights, thereby maintaining packaging precision while enabling optical signal transmission capability
2Productivity
If multiple functional elements are densely packed in multi-level composite structure, then device density is improved, but heat transfer efficiency deteriorates
Solution Approach 1:
The package structure is segmented into multiple functional layers including a board, a silicon photonics device platform mounted on the board, and a step difference control part. This segmentation allows heat to be dissipated through multiple pathways: heat from the silicon photonics device can be transferred to the board through the step difference control part, while heat from other functional devices on the board can be transferred directly to the board, improving overall heat transfer efficiency while maintaining high device density
3Adaptability or versatility
If optical coupling block is added to connect optical interface and silicon photonics device, then optical coupling capability is improved, but structural complexity increases
Solution Approach 1:
The support part and the step difference control part are merged into a single integrated component. The support part has a first surface that contacts the optical coupling block and a second surface that contacts the board, combining the functions of structural support and step difference control into one element, thereby reducing structural complexity while maintaining optical coupling capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively controls step differences, optimizes heat transfer, and enhances optical system fixing and adhering capabilities, addressing the evolution direction of optical device packages and improving precision in packaging silicon optical devices compared to conventional III-V compound optical devices.
Implementation Method 1
a body part configured to transfer heat transferred through the step difference control part and heat transferred through a lower surface of the board to the outside
Data Source
AI summary
A package for a silicon photonics device and an implementation method thereof are disclosed. The package for a silicon photonics device according to one embodiment includes a step difference control part having an upper surface, where a silicon photonics device platform having a silicon photonics device mounted thereon is mounted, and configured to control a step difference generated between the silicon photonics device platform and one or more functional electronic devices mounted on an upper surface of a board and a body part configured to transfer heat transferred through the step difference control part and heat transferred through a lower surface of the board to the outside by mounting the step difference control part on at least a partial region of an upper surface thereof and bringing the lower surface of the board into close contact with at least a part of the remaining region except for the partial region.