Integrated Silicon Photonics Transceivers for Tb/s Interconnects

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Solution Overview

Problem

Current optical communication systems face limitations in speed and density due to expensive, bulky packaging and inefficient thermal dissipation, which restricts their ability to support ultra-high-speed and high-density I/O and interconnects.

Innovation Solution

The integration of flip chip bonding (FCB) and through silicon via (TSV) within a photonic integrated circuit (PIC) enables ultra-high-speed I/O and interconnects, efficient thermal dissipation, and on-chip termination and bias networks, supporting high baud rates and channel counts for Tb/s optical interconnects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If current packaging methods are used for optical communication systems, then the system structure is simple to manufacture, but the system becomes expensive, bulky, and limited in speed

Engineering Contradiction:

Improvedata transmission speedVSAvoidpackaging complexity

Core Design Contradiction:

SpeedVSDevice complexity

Solution Approach 1:

The patent combines multiple functional components (optical modulators, photodetectors, RF termination networks, bias networks, and interconnect structures) into a single integrated photonic packaging structure. This merging enables ultra-high-speed data transmission while managing the complexity through unified design and fabrication processes.

Inventive Principle:

Principle #5Merging (Combining)

2Productivity

If higher speed optical signaling is implemented, then bandwidth density increases, but thermal dissipation becomes inefficient

Engineering Contradiction:

Improvebandwidth densityVSAvoidthermal dissipation efficiency

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent introduces specialized thermal management structures and heat dissipation pathways as intermediary elements between the high-power optical components and the packaging environment. These intermediary thermal pathways enable efficient heat removal while maintaining the high bandwidth density required for ultra-high-speed operation.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Speed

If integrated silicon photonics transceivers are used, then ultra-high-speed transmission is achieved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvedata transmission speedVSAvoidintegration precision

Core Design Contradiction:

SpeedVSManufacturing precision

Solution Approach 1:

The patent segments the integrated photonic system into modular functional blocks (transmitter sections, receiver sections, RF networks, and interconnect structures) that can be independently fabricated and then precisely integrated. This segmentation approach manages manufacturing precision requirements by allowing specialized fabrication processes for each module while maintaining overall system performance.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS12321025B2Integrated silicon photonics transceivers enabling ultra-high-speed high dense input/output and interconnect for Terabyte per second optical interconnect

Publication Date: 2025.06.03 INTEL CORP

AI summary

In one embodiment, an optical transceiver includes: a photonic integrated circuit (PIC) formed on a semiconductor die having a first side and a second side opposite the first side, where the first side includes a first optical circuit and a second optical circuit and the second side is to electrically couple with a substrate. The PIC may further have one or more through silicon vias (TSVs) formed through the semiconductor die to electrically couple the first side with the second side, where at least one of the TSVs is to enable electrical coupling between a first other die adapted to the first side and a second other die. Other embodiments are described and claimed.