Silicon Photonics Circuits With Undercladding Heat Isolation
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Solution Overview
Problem
Thermo-optic phase shifters using silicon thin wire waveguides face issues with high power consumption due to heat conduction through the silicon support substrate, which is conductive and lacks effective heat insulation, and the production method leads to warpage and damage of the core layer during the formation of a thick undercladding layer.
Innovation Solution
A silicon photonics circuit design with a thick undercladding layer and strategic placement of heat insulation grooves and heaters to minimize heat dissipation and power consumption, using a multi-layer substrate structure with a thick undercladding layer and careful bonding techniques to prevent warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a thick undercladding layer is formed on the silicon support substrate to improve heat insulation, then power consumption is reduced, but the support substrate experiences warpage and the core layer is damaged during formation
Solution Approach 1:
The undercladding layer is segmented into multiple thin layers (first undercladding layer and second undercladding layer) formed at different stages. This segmentation prevents warpage by distributing the thermal stress across multiple thin formations rather than one thick formation, while still achieving the total thickness needed for heat insulation.
Solution Approach 2:
The first undercladding layer is formed preliminarily before the core layer to provide initial heat insulation. Subsequently, the second undercladding layer is formed after the core layer to complete the thermal insulation. This preliminary and sequential action allows the core layer to be protected from warpage while achieving complete thermal insulation.
2Loss of energy
If heat insulation grooves are introduced to reduce heat conduction, then power consumption decreases, but the device structure becomes more complex
Solution Approach 1:
The heat insulation function is merged into the undercladding layer itself by forming it with low thermal conductivity material (such as silicon oxide) rather than adding separate heat insulation grooves. This combines the structural support and thermal insulation functions into a single integrated layer, reducing overall device complexity.
Solution Approach 2:
The undercladding layer acts as an intermediary between the silicon support substrate and the core layer, providing thermal insulation without requiring direct contact modifications to the core layer or substrate. This intermediary approach simplifies the overall structure compared to groove-based insulation methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces power consumption and maintains structural integrity by minimizing heat loss through the support substrate and ensuring precise core layer formation without warpage, enhancing the efficiency and accuracy of the thermo-optic phase shifter.
Implementation Method 1
when heat is applied to the waveguide using a thin film heater or the like, a change in the refractive index of the waveguide core due to the thermo-optic effect is induced and the phase of light propagating in the waveguide can be controlled
Implementation Method 2
an underclad formed on one side of the support substrate... effectively reduces power consumption and maintains structural integrity by minimizing heat loss through the support substrate
Data Source
AI summary
A silicon photonics circuit is configured of a support substrate, an underclad formed on one side of the support substrate, a core which is in contact with a side of the underclad opposite to the side which is in contact with the support substrate and is formed of a member containing silicon, a pattern structure which is in contact with the core, matches a shape and a size of the core in a top view, and is formed of a member having a lower refractive index than the core, and a heater which heats the core to change a refractive index of light in the core.