Silicon PN-Junction Light Emission via Reverse Bias Avalanche

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

CMOS silicon semiconductor manufacturing processes are inefficient in generating and coupling light due to insulating silicon dioxide and metal interconnect layers on the top face of integrated circuits, which inhibit and distort light emission, making them unsuitable for high-speed optical communication systems.

Innovation Solution

A light emitting device using an indirect bandgap semiconductor material with a pn-junction configured for reverse biased breakdown mode, where the insulating and interconnect layers are adapted to reflect light towards a secondary face for improved transmission, allowing for efficient coupling of near-infrared light beyond 1 μm wavelength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If standard CMOS silicon semiconductor manufacturing processes are used with forward-biased pn-junctions, then light emission is achieved, but switching speed is limited to a few hundred kHz

Engineering Contradiction:
Improveswitching speedVSAvoidelectroluminescent efficiency
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent changes the biasing parameter of the pn-junction from forward-bias to reverse-bias operating mode. This parameter change enables the junction to operate in avalanche breakdown mode, achieving GHz switching speeds while maintaining useful light emission in the 350 nm to 1.7 μm wavelength range, particularly around 700 nm peak

Inventive Principle:
Principle #35Parameter changes

2Speed

If reverse-biased avalanching pn-junctions are used, then switching speed increases to GHz levels, but electroluminescent efficiency decreases

Engineering Contradiction:
Improveswitching speedVSAvoidelectroluminescent efficiency
Core Design Contradiction:
SpeedVSUse of energy by moving object

Solution Approach 1:

The patent converts the harmful effect of avalanche breakdown (typically associated with high power consumption and heat) into a beneficial light source. By operating the reverse-biased pn-junction in avalanche breakdown mode, the device generates useful photons in the visible and near-infrared range while achieving fast switching speeds, effectively turning the energy-dissipating avalanche effect into a productive electroluminescent source

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Ease of manufacture

If insulating silicon dioxide and metal interconnect layers are present on the top face of CMOS IC, then standard IC manufacturing is enabled, but light out-coupling is inhibited and radiation pattern is distorted

Engineering Contradiction:
ImproveIC manufacturing compatibilityVSAvoidlight out-coupling efficiency
Core Design Contradiction:
Ease of manufactureVSIllumination intensity

Solution Approach 1:

The patent inverts the conventional light emission approach by orienting the light-emitting pn-junction away from the standard top face (first face) with insulating and metal layers. Instead, light is emitted through the bottom face (other face) of the silicon body, which is naturally transparent to the generated wavelengths. This inversion allows standard CMOS manufacturing processes to be used while enabling efficient light out-coupling through the opposite face

Inventive Principle:
Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient light emission and coupling of near-infrared light with high switching speeds, overcoming the inefficiencies of standard CMOS ICs and enabling their use in optical communication systems by enhancing light transmission and radiation patterns.

Implementation Method 1

reverse-biased avalanching silicon pn-junctions emit light in a wide band from 350 nm to 1.7 μm, with a peak at about 700 nm

Methodology Applied
Scientific EffectAvalanche breakdown: Avalanche Breakdown

Implementation Method 2

forward-biased silicon pn-junctions emit light in a narrow band around 1.1 μm

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 3

at least part of the configuration may be adapted or processed to reflect emitted light towards the other face

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 4

a body of an indirect bandgap semiconductor material having a first face and at least one other face

Methodology Applied
Scientific EffectIndirect bandgap emission:

Data Source

PatentUS9515227B2Near infrared light source in bulk silicon
Publication Date: 2016.12.06 INSIAVA (PTY) LTD
  • US9515227B2 patent drawing
  • US9515227B2 patent drawing

AI summary

A light emitting device (10) comprises a body (12) of a semiconductor material having a first face (14) and at least one other face (16). At least one pn-junction (18) in the body is located towards the first face and is configured to be driven via contacts on the body into a light emitting mode. The other face (16) of the body is configured to transmit from the body light emitted by the at least one pn-junction (18) in the near infrared part of the spectrum and having wavelengths longer than 1 μm.