Silicon Radiation Window with Masked Support Structure

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Solution Overview

Problem

Existing radiation windows, particularly for soft x-rays, face challenges in being both transparent and durable due to air scattering and absorption, requiring vacuum operation and thin, fragile window designs that are prone to breakage.

Innovation Solution

A radiation window structure is created using a continuous window layer supported by a silicon-based structure on one side and partially exposed on the other, with optional surface layers like aluminium or graphene to enhance transparency and durability, allowing for improved radiation transmission while maintaining structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the window thickness is reduced to increase transparency, then radiation transmission is improved, but the window becomes more prone to breakage

Engineering Contradiction:
ImprovetransparencyVSAvoiddurability
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The window is divided into a thin transparent layer and separate supporting structures, allowing the transparent layer to be optimized for radiation transmission while the supporting structures provide mechanical strength

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The supporting structures are strategically positioned to provide local reinforcement only where needed for mechanical support, leaving the majority of the window area thin and highly transparent to radiation

Inventive Principle:
Principle #3Local quality

2Reliability

If the window is made thinner to admit more soft x-rays, then transparency is improved, but the window is more likely to break under atmospheric pressure

Engineering Contradiction:
ImprovetransparencyVSAvoidbreakage risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The supporting structures act as counterweights against the atmospheric pressure, providing mechanical support to compensate for the reduced thickness of the transparent window layer

Inventive Principle:
Principle #8Anti-weight (Counterweight)

Solution Approach 2:

The supporting structures are pre-positioned and the thin layer is deposited over them before the window is exposed to atmospheric pressure, ensuring the structure is already in place to prevent breakage

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the transparency and durability of radiation windows, allowing for effective soft x-ray transmission while withstanding atmospheric pressure, reducing the likelihood of breakage and maintaining high-quality layer formation.

Implementation Method 1

Radiation measurement devices operate by determining a reaction of a detector device to incoming radiation. For example, an x-ray camera may receive x-rays and determine their intensity

Methodology Applied
Scientific EffectX-ray transmission: X-Ray

Implementation Method 2

etching one of the wafers to partially expose a window layer deposited on the opposite silicon wafer and to leave a structure defined by the mask supporting the window layer

Methodology Applied
Scientific EffectEtching: Ablation

Implementation Method 3

a window layer deposited on the opposite silicon wafer

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS10943756B2Radiation window
Publication Date: 2021.03.09 OXFORD INSTR TECH OY
  • US10943756B2 patent drawing
  • US10943756B2 patent drawing
  • US10943756B2 patent drawing

AI summary

According to an example aspect of the present invention, there is provided a method comprising obtaining a first silicon wafer comprising a mask on a first side, attaching a second silicon wafer on the first side of the first silicon wafer, and etching one of the wafers to partially expose a window layer deposited on the opposite silicon wafer and to leave a structure defined by the mask supporting the window layer.