Silicon Ring Fusion Bonding Using Powder and Induction Heating
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Solution Overview
Problem
Conventional methods for bonding silicon parts, such as confinement rings, are complex and prone to material breakage due to lack of stable fixation, leading to low machining yield and material loss, and result in deteriorated etching and film deposition quality.
Innovation Solution
A method involving the formation of concave and convex coupling surfaces on silicon parts, followed by the use of single crystal silicon powder and high-frequency heating to fuse the parts together, utilizing a silicon part fusion bonding apparatus with molybdenum fixing devices and controlled heating and cooling processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional bonding methods (screw-bonding or separation through connection parts) are used to bond silicon parts, then the bonding structure becomes complex, but the bonding strength and stability deteriorate, leading to particle generation and quality deterioration
Solution Approach 1:
The patent replaces mechanical bonding methods (screw-bonding, connection parts) with high-frequency induction heating that melts silicon powder to achieve fusion bonding. This substitution eliminates the need for complex mechanical bonding structures while providing stable, particle-free bonding suitable for semiconductor applications
Solution Approach 2:
The patent changes the bonding mechanism from mechanical to thermal by using high-frequency induction heating to melt silicon powder at the bonding interface. This parameter change enables direct fusion bonding of silicon parts without mechanical intermediaries, achieving both structural simplicity and bonding reliability
2Device complexity
If slot machining is performed on floating C-ring without separate fixing device, then the machining process becomes simpler, but the machining precision deteriorates due to unstable fixation
Solution Approach 1:
The patent applies preliminary action by performing slot machining on the C-ring before bonding it to the support plate. This allows the C-ring to be precisely machined while free-floating, then later secured through fusion bonding, achieving both machining simplicity and positioning stability
3Ease of manufacture
If conventional bonding methods are used for silicon parts, then the bonding process becomes complex, but particle generation increases, deteriorating etching and film deposition quality
Solution Approach 1:
The patent replaces mechanical bonding processes with high-frequency induction heating that melts silicon powder to achieve fusion bonding. This eliminates particle generation associated with mechanical bonding while simplifying the bonding process through direct thermal fusion
Solution Approach 2:
The patent utilizes phase transition by melting silicon powder through high-frequency induction heating to achieve fusion bonding. The phase change from solid to liquid and back to solid creates a strong, particle-free bond between silicon parts, improving ease of manufacture and reducing harmful particles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a simple and effective bonding configuration that enhances the quality of etching and film deposition by ensuring stable and strong bonding of silicon parts, reducing material loss and improving machining yield.
Implementation Method 1
heating and fusing the bonding surfaces of the lower ring and the upper ring
Implementation Method 2
heating and fusing the bonding surfaces of the lower ring and the upper ring
Data Source
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AI summary
The present invention relates to a method of bonding silicon parts using silicon powder and high-frequency heating device, the method comprising the steps of: forming concave and convex coupling surfaces on the bonding surfaces of a lower ring and an upper ring; mounting the lower ring and the upper ring on a silicon part fusion bonding apparatus; injecting single crystal silicon powder into the concave and convex coupling surfaces on the bonding surfaces of the lower ring and the upper ring; and heating and fusing the bonding surfaces of the lower ring and the upper ring.