Silicon Ring-Shaped Member Joining via Optical Heating

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Solution Overview

Problem

The manufacturing of large ring-shaped members for dry etching apparatuses using silicon components is hindered by the high cost and difficulty in fabricating components from silicon crystal ingots with diameters larger than the wafer being processed, as smaller ingots are not efficiently utilized.

Innovation Solution

A method of joining multiple silicon members using optical heating to melt and crystallize silicon at their abutting surfaces, forming a silicon adhesion part that integrates the members, allowing for the creation of larger ring-shaped members from smaller silicon crystal ingots.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a silicon component is fabricated from a silicon crystal ingot with a diameter larger than the wafer to be etched, then the component can be manufactured as an integrated piece, but the manufacturing cost increases significantly

Engineering Contradiction:

Improveintegrated component qualityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The ring-shaped member is divided into multiple separate silicon members (first silicon member and second silicon member) that are joined together. This allows fabrication from smaller silicon crystal ingots that are more readily available and less expensive, while still achieving the required functional integrity through the joining process.

Inventive Principle:

Principle #1Segmentation

2Strength

If a silicon component is fabricated from a silicon crystal ingot with a diameter larger than the wafer to be etched, then the component maintains high structural integrity, but it becomes substantially impossible to fabricate large ring-shaped side wall members

Engineering Contradiction:

Improvestructural integrityVSAvoidfabrication feasibility

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The ring-shaped member is segmented into multiple silicon members that can be fabricated from smaller, available silicon crystal ingots. These segmented members are then joined together to form the complete ring structure, making fabrication of large-diameter components (700mm or more) feasible when monolithic fabrication would be impossible.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The joining process utilizes optical heating (xenon lamp or halogen lamp) to melt silicon at the abutting surfaces, creating a silicon adhesion part that bonds the silicon members together. This parameter change (heating to melting point) enables the creation of strong joints between segmented members.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If multiple silicon members are joined to form a ring-shaped member, then smaller silicon crystal ingots can be utilized, but the joining process complexity increases

Engineering Contradiction:

Improveingot size availabilityVSAvoidjoining process complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The joining process replaces conventional mechanical or thermal joining methods with optical heating using xenon or halogen lamps. This substitution enables precise localized heating to melt silicon at the abutting surfaces without requiring complex mechanical pressure systems or furnace-based heating, thereby managing process complexity while achieving reliable joins.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs by enabling the use of smaller silicon ingots and prevents metal contamination within the vacuum chamber, ensuring the ring-shaped members maintain their crystallinity and mechanical integrity during plasma processing.

Implementation Method 1

heating the one abutting surface and the other abutting surface through optical heating by a xenon lamp or a halogen lamp to melt silicon on a surface of the one abutting surface and silicon on a surface of the other abutting surface

Methodology Applied

Scientific EffectOptical heating: Absorption (EM radiation)

Implementation Method 2

silicon melt is caused to flow into a gap between the one abutting surface and the other abutting surface

Methodology Applied

Scientific EffectCapillary phenomenon: Capillary Action

Implementation Method 3

cooling the one abutting surface and the other abutting surface to crystallize the silicon melt forming a silicon adhesion part such that the one silicon member and the other silicon member are joined to each other with the silicon adhesion part

Methodology Applied

Scientific EffectCrystallization: Crystallisation

Data Source

PatentUS11551915B2Method of manufacturing ring-shaped member and ring-shaped member

Publication Date: 2023.01.10 THINKON NEW TECH JAPAN CORP

AI summary

Provided are a method of manufacturing a ring-shaped member and the ring-shaped member. A method of manufacturing a ring-shaped member to be placed in a process chamber of a substrate processing apparatus includes arranging one silicon member and another silicon member to cause one abutting surface of the one silicon member and another abutting surface of the other silicon member to abut on each other, heating the one abutting surface and the other abutting surface through optical heating to melt silicon on a surface of the one abutting surface and silicon on a surface of the other abutting surface such that silicon melt is caused to flow into a gap between the one abutting surface and the other abutting surface, and cooling the one abutting surface and the other abutting surface to crystallize the silicon melt forming a silicon adhesion part.