Silicon Ring Resonator Trimming via Ion Implantation and Annealing

Solution Overview

Problem

Silicon-on-insulator micro-ring resonators face challenges in achieving precise wavelength spacing due to fabrication variations, leading to increased power consumption and complexity in thermal tuning and control, especially in multi-ring systems.

Innovation Solution

The method involves introducing lattice defects via MeV boron ion implantation and subsequent annealing using integrated titanium-nitride micro-heaters, allowing for post-fabrication trimming of silicon-on-insulator micro-ring resonators to achieve precise resonance shifts and reduce thermal tuning requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If individual thermal tuning is used for each ring resonator to compensate fabrication variation, then manufacturing precision is improved, but device complexity and power consumption increase

Engineering Contradiction:
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by performing ion implantation during fabrication to pre-adjust the resonance wavelengths of ring resonators. This anticipates fabrication variations and compensates for them before the device is fully assembled and operated, eliminating the need for complex post-assembly individual thermal tuning of each ring.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent substitutes the thermal tuning mechanism with an ion implantation process that permanently modifies the optical path length. Instead of using thermal effects (mechanical expansion/contraction) to tune each ring individually, the invention uses ion implantation to create permanent refractive index changes, replacing the need for complex thermal control systems.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If ion implantation is used for resonance trimming, then manufacturing precision is improved, but Q-factor decreases due to increased optical loss

Engineering Contradiction:
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies parameter changes by carefully controlling the ion implantation dose and energy to achieve the desired resonance wavelength shift while minimizing damage to the crystal lattice. By optimizing these parameters, the invention achieves precise wavelength trimming with minimal impact on Q-factor.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies local quality by performing selective ion implantation only in specific regions of the ring resonator where wavelength adjustment is needed. This localized approach allows precise control over which parts of the resonator are modified, enabling wavelength tuning while preserving the overall quality of the optical mode and minimizing Q-factor degradation.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables stable resonance red-shifting and blue-shifting, allowing for precise trimming of resonances to achieve fixed wavelength spacing, reducing power consumption and complexity in device control, while minimizing impact on the Q-factor.

Implementation Method 1

annealing the silicon ring resonator using the heating element

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

annealing the silicon ring resonator using the heating element, wherein the annealing shifts the resonance

Methodology Applied
Scientific EffectThermal annealing: Annealing

Implementation Method 3

subjecting the silicon ring resonator to energetic ion implantation, wherein the energetic ion implantation shifts a resonance

Methodology Applied
Scientific EffectIon implantation: Ion Implantation

Data Source

PatentUS11808978B2Post-fabrication trimming of silicon ring resonators via integrated annealing
Publication Date: 2023.11.07
  • US11808978B2 patent drawing
  • US11808978B2 patent drawing
  • US11808978B2 patent drawing

AI summary

Methods for post-fabrication trimming of a silicon ring resonator are disclosed. Methods include fabricating a heating element, positioned within 2 microns of the silicon ring resonator, subjecting the silicon ring resonator to energetic ion implantation, and annealing the silicon ring resonator, using the heating element. The energetic ion implantation shifts a resonance of the silicon ring resonator towards the red side of the electro-magnetic spectrum. The annealing shifts the resonance of the silicon ring resonator towards the blue side of the electro-magnetic spectrum.