Silicon Seed Rods with Flat Cross-Section and Low Resistivity

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Solution Overview

Problem

The Siemens process for manufacturing high-purity polycrystalline silicon suffers from slow deposition rates due to small surface area and high resistivity of silicon seed rods, requiring expensive pre-heating and potential contamination from metal core rods.

Innovation Solution

The method involves manufacturing long silicon seed rods with a flatter cross-sectional shape and lower resistivity by doping the silicon melt with oxygen, forming a silicon dioxide film, and using a growth reactor with an inductor heater and cooling fluid, allowing for semi-continuous or continuous rod production and reducing the need for pre-heating and welding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional silicon seed rods with slender diameter (around 5 mm) are used, then the rod structure is simple and easy to manufacture, but the surface area available for deposition is small resulting in slow deposition rate

Engineering Contradiction:
Improvedeposition rateVSAvoidsurface area of seed rod
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The patent changes the geometric parameters of the silicon seed rod by introducing a flatter cross-sectional shape with increased width and reduced thickness, transforming the traditional cylindrical shape into a plate-like structure. This parameter change increases the surface area from the conventional slender cylindrical surface to a larger flat surface, directly improving the deposition rate while maintaining structural integrity through controlled dimensions

Inventive Principle:
Principle #35Parameter changes

2Use of energy by moving object

If high-resistivity silicon rods (1 kiloohm-cm or higher) are used, then the material purity is maintained, but it is difficult to pass current through the rod at room temperature requiring expensive pre-heating devices and consuming large amounts of electric energy

Engineering Contradiction:
Improveelectric energy consumptionVSAvoidelectrical conductivity of rod
Core Design Contradiction:
Use of energy by moving objectVSReliability

Solution Approach 1:

The patent modifies the electrical parameter of the silicon rod by controlling the oxygen content during crystal growth. By optimizing the oxygen concentration in the silicon lattice, the resistivity is reduced from the conventional 1 kiloohm-cm or higher to a lower value that allows sufficient current passage at room temperature, eliminating the need for expensive pre-heating devices and reducing energy consumption

Inventive Principle:
Principle #35Parameter changes

3Stability of the object's composition

If metal core rods (Mo, W, Ta, Nb) with high recrystallization temperature are used instead of silicon seed rods, then the rod structural stability is improved, but the core part must be removed after reaction and metals cause diffusion into the deposited silicon

Engineering Contradiction:
Improverod structural stabilityVSAvoidmetal contamination of deposited silicon
Core Design Contradiction:
Stability of the object's compositionVSObject-generated harmful factors

Solution Approach 1:

The patent applies homogeneity by using pure silicon material throughout the entire rod structure without metal cores or composite materials. The silicon seed rod is manufactured as a homogeneous single-material structure through controlled crystal growth, eliminating the heterogeneity introduced by metal cores while maintaining structural stability through optimized silicon crystal orientation and purity control

Inventive Principle:
Principle #33Homogeneity

4Ease of manufacture

If short silicon seed rods are manufactured by hewing out from long silicon rods, then the manufacturing process is simple, but the silicon seed rods become shorter after every manufacturing cycle requiring periodic manufacturing from long rods

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidlength of silicon seed rod
Core Design Contradiction:
Ease of manufactureVSLength of moving object

Solution Approach 1:

The patent enables continuous production of long silicon seed rods through optimized crystal growth processes that can sustain extended growth cycles without interruption. The continuous availability of long rods eliminates the periodic need to manufacture new rods from shorter ones, maintaining manufacturing simplicity while ensuring continuous supply of full-length rods for production

Inventive Principle:
Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the deposition rate and stability, reduces production costs, and prevents contamination, enabling the production of high-purity silicon seed rods with controlled parameters and improved efficiency.

Implementation Method 1

an inductor heater providing a silicon melt column above a die

Methodology Applied
Scientific EffectInduction heating: Induction Heating

Implementation Method 2

cooling the silicon columnar rods in a fluid bath

Methodology Applied
Scientific EffectCooling: Cooling

Implementation Method 3

forming a film of silicon dioxide on the silicon rod... the reaction between the silicon melt and oxygen

Methodology Applied
Scientific EffectOxidation: Oxidation

Data Source

PatentUS8911659B2Method and apparatus for manufacturing silicon seed rods
Publication Date: 2014.12.16 CREATIVE INNOVATIONS
  • US8911659B2 patent drawing
  • US8911659B2 patent drawing
  • US8911659B2 patent drawing

AI summary

A method and apparatus for manufacturing high-purity long silicon seed rods with controlled resistivity for Siemens and similar processes with using a film of silicon dioxide, wherein a film of silicon dioxide is formed on the seed rod in the course of a reaction between a silicon melt and oxygen. The rod is formed with a quartz die and cooled by direct immersion into a cooling fluid, such as de-ionized water and/or by cooling fluid vapor in the gas cooling zone.