Silicon Substrate Optoelectronic Module Thermal Management
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Solution Overview
Problem
Existing optoelectronic modules face challenges in minimizing footprint, heat transfer, and maintaining optical properties under varying temperatures, particularly in compact devices like smartphones.
Innovation Solution
The use of a silicon substrate for optoelectronic modules, which reduces the need for a printed circuit board, allows for improved heat transfer due to high thermal conductivity, and minimizes optical property degradation through a spacer that is opaque to light wavelengths, enabling a smaller footprint and enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a printed circuit board substrate is used, then wiring and connections are easier to implement, but the module footprint increases and cost increases
Solution Approach 1:
The patent merges the substrate function with the silicon carrier by integrating wiring traces, electrical connections, and mechanical support functions directly into the silicon substrate itself, eliminating the need for a separate printed circuit board. This consolidation reduces the overall module footprint while maintaining all necessary electrical interconnections through silicon-based trace routing and bond pad structures.
Solution Approach 2:
The silicon substrate serves multiple functions simultaneously: it provides mechanical support, electrical connectivity through integrated traces, thermal management, and optical pathway definition. This multi-functionality replaces what would traditionally require separate components (PCB, mounting structure, thermal interface), thereby reducing footprint and component count.
2Loss of energy
If conventional substrates are used, then manufacturing is simpler, but heat transfer away from the module is poor
Solution Approach 1:
The patent changes the material parameter of the substrate from conventional low thermal conductivity materials (FR4, aluminum) to silicon, which has high thermal conductivity. This parameter change dramatically improves heat transfer efficiency away from the optoelectronic components, enabling effective thermal management without adding complex active cooling systems.
Solution Approach 2:
The module employs a composite structure where silicon serves as the primary substrate material for its superior thermal properties, while additional thermal management features such as thermal vias, heat sinks, or heat spreaders may be integrated to create a multi-layer thermal management system that combines different materials' advantages.
3Reliability
If standard substrates are used, then manufacturing is easier, but optical properties degrade when temperatures vary
Solution Approach 1:
The patent changes the substrate material parameter to silicon, which has a low coefficient of thermal expansion and high thermal conductivity. These parameter changes enable the substrate to maintain dimensional stability and optical property consistency across temperature variations, preventing degradation of optical alignment and performance in varying thermal environments.
Solution Approach 2:
The patent addresses thermal expansion effects by selecting silicon as the substrate material, which has a coefficient of thermal expansion that better matches the optoelectronic components. This reduces differential thermal expansion between the substrate and mounted components, maintaining optical alignment and preventing stress-induced optical property degradation during temperature cycling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in reduced module costs, improved heat transfer, and minimized optical property degradation, making the modules more efficient and reliable in compact devices.
Implementation Method 1
as the thermal conductivity of silicon is relatively high, heat transfer away from the module can be improved
Implementation Method 2
The spacer preferably is substantially opaque to, or significantly attenuates, light at wavelengths emitted and/or detectable by the optoelectronic device
Data Source
AI summary
Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.