Silicon Base Substrate for Accurate Vibration Temperature Detection
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Solution Overview
Problem
In vibration devices with ceramic substrates, insufficient thermal coupling between circuit elements and vibrators leads to inaccurate temperature detection by temperature sensors.
Innovation Solution
A vibration device with a silicon base substrate and a lid bonded using direct bonding methods, incorporating a thermistor element and a vibrator thermally coupled via a high thermal conductivity silicon base, ensuring accurate temperature detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic substrate with low thermal conductivity is used, then electrical insulation is improved, but thermal coupling between the circuit element and vibrator deteriorates
Solution Approach 1:
The patent introduces a thermally conductive member as an intermediary between the circuit element and the ceramic substrate. This member has high thermal conductivity in the direction from the circuit element to the vibrator, enabling effective thermal coupling while the ceramic substrate maintains its electrical insulation function. The intermediary resolves the contradiction by decoupling the thermal and electrical functions into separate components.
2Reliability
If a ceramic substrate is used, then electrical insulation is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent employs a composite structure combining a ceramic substrate with a thermally conductive member. The ceramic substrate provides electrical insulation while the thermally conductive member (made of materials like aluminum nitride, silicon nitride, or copper) provides high thermal conductivity. This composite approach allows both materials to contribute their superior properties without compromising each other's function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced thermal coupling and accurate temperature detection, improving the reliability of temperature measurements in vibration devices.
Implementation Method 1
a thermally conductive member that thermally couples the circuit element to the lid
Data Source
AI summary
A vibration device includes a base substrate made of silicon and having a first surface and a second surface facing away from the first surface, a lid bonded to the base substrate, a vibrator disposed at the first surface of the base substrate and accommodated in a space between the base substrate and the lid, and a thermistor element disposed at the base substrate.