Silicon Wafer Bending Detection via Image Scanning
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Solution Overview
Problem
The existing manufacturing processes for solar cells face challenges in accurately detecting and addressing the bending and warping degrees of silicon wafers after polishing, leading to potential breakage and material waste due to improper handling.
Innovation Solution
A device and method utilizing an image scanning assembly with a CCD camera and image processing system to detect the bending and warping degrees of silicon wafers by comparing scanned images to standards, ensuring accurate detection and prevention of damage during handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If suction mechanism is used to grasp the silicon wafer, then the silicon wafer can be held and moved, but the silicon wafer may be thrown out and broken due to bending and warping
Solution Approach 1:
The patent implements a detection mechanism that measures the bending and warping degree of silicon wafers before they are grasped by the suction mechanism. This preliminary detection allows the system to identify wafers with excessive deformation and exclude them from further processing, preventing breakage during handling while maintaining efficient operation for suitable wafers.
2Productivity
If silicon wafer with bending and warping is processed, then production continues, but raw material is wasted and production efficiency is affected
Solution Approach 1:
The patent establishes a feedback control system where the detection mechanism continuously monitors silicon wafer bending and warping degrees, and the control system uses this information to make real-time decisions about whether to proceed with processing or discard the wafer. This feedback loop prevents waste by ensuring only suitable wafers are processed, while maintaining productivity by quickly identifying and removing defective wafers from the production line.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and precise detection of silicon wafer deformation, preventing breakage and material loss by ensuring proper handling and alignment, thus improving production efficiency and reducing waste.
Implementation Method 1
The conveying mechanism above the lower carrier plate is provided with a photoelectric sensor. The photoelectric sensor is configured to detect whether the silicon wafer of the solar cell has moved on the lower carrier plate.
Implementation Method 2
The scanning lamp, the reflector, the mirror and the CCD camera are optically connected. The image scanning assembly is configured to scan and image the silicon wafer of the solar cell.
Data Source
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AI summary
The present invention provides a device and method for detecting the bending and the warping of a silicon wafer of a solar cell. A feeding mechanism places the silicon wafer of the solar cell on a conveying mechanism. The conveying mechanism drives the silicon wafer of the solar cell to move to a detection box. When a photoelectric sensor detects that there is a silicon wafer of the solar cell reaching the position above a lower carrier plate, a lifting cylinder drives the lower carrier plate to move up and cover the opening of the detection box, so that the detection box has no light inside. Then, a scanning lamp is started to emit light onto the silicon wafer of the solar cell, and the light passes through an optical system and enters a CCD camera for imaging. An image is sent to an image processing system. The image processing system processes the image, and compares the image with a standard image. The comparison result is sent to a computer host and displayed by a display. Accordingly, the bending and warping are detected.