Silicon Wall Airflow Control on Printed Circuit Boards

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Solution Overview

Problem

Existing printed circuit boards face challenges in controlling airflow effectively, particularly when vertically oriented or in systems without preformed walls, leading to heat-related issues and increased manufacturing complexity due to the need for separate, affixed airflow directing components.

Innovation Solution

A silicon wall is directly deposited onto the printed circuit board during construction to control airflow, preventing hot air from impinging on components and guiding airflow for temperature regulation, which can be applied between or around components and power planes, and can be used in conjunction with adjacent boards for enhanced cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If preformed walls made of paper, plastic, or sheet metal are placed around components on the board, then airflow control is achieved, but device complexity and manufacturing steps increase

Engineering Contradiction:

Improveairflow controlVSAvoidmanufacturing complexity

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The airflow control wall is merged with the printed circuit board by depositing it directly onto the board surface during manufacturing. This integration eliminates the need for separate preformed walls and their associated alignment and attachment steps, thereby reducing device complexity while maintaining airflow control functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The wall is deposited directly onto the printed circuit board during the board construction process, before components are mounted. This preliminary action of forming the airflow control structure during board fabrication eliminates subsequent manufacturing steps required for adding separate walls, reducing overall manufacturing complexity.

Inventive Principle:

Principle #10Preliminary action

2Ease of operation

If separate walls are affixed to the board, then airflow control is achieved, but manufacturing steps and assembly complexity increase

Engineering Contradiction:

Improveairflow controlVSAvoidmanufacturing steps

Core Design Contradiction:

Ease of operationVSEase of manufacture

Solution Approach 1:

The airflow control function is merged into the printed circuit board structure itself through direct deposition. This eliminates the need for separate wall components and their associated alignment and attachment operations, thereby simplifying manufacturing steps while achieving the same airflow control objective.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The wall structure is formed during the printed circuit board construction process itself, before component assembly. This preliminary formation of airflow control features during board fabrication eliminates subsequent assembly steps for adding separate walls, reducing manufacturing complexity.

Inventive Principle:

Principle #10Preliminary action

3Area of stationary object

If vertically oriented board placement is used, then space utilization is improved, but heat from bottom components affects components above them

Engineering Contradiction:

Improvespace utilizationVSAvoidcomponent temperature

Core Design Contradiction:

Area of stationary objectVSTemperature

Solution Approach 1:

Airflow control walls are deposited at specific locations on the board where heat management is needed. These localized walls create targeted airflow paths that direct cool air to heat-generating components and prevent hot air from rising and affecting other components, thereby managing temperature in specific areas without changing board orientation.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The silicon wall effectively manages airflow across the board and its components, reducing heat transfer between components and improving temperature regulation without the need for external fans, thus simplifying manufacturing and enhancing cooling efficiency.

Implementation Method 1

the silicon wall controls airflow across the board and around components mounted to the board

Methodology Applied

Scientific EffectAirflow control through physical barriers:

Implementation Method 2

preventing hot air from impinging on components and guiding airflow for temperature regulation

Methodology Applied

Scientific EffectThermal convection blocking:

Data Source

PatentUS8179679B2Airflow guides using silicon walls/creating channels for heat control

Publication Date: 2012.05.15 NETAPP INC

AI summary

An electronic device includes a printed circuit board having a wall deposited directly on a board serving as a base for a printed circuit. As the board is constructed, the wall is deposited on the board for controlling airflow. The wall controls airflow across the board and around components mounted to the board. The wall may be utilized for controlling airflow in combination with a second printed circuit board positioned adjacent to the first printed circuit board. The wall may be utilized for controlling various types of airflow, including airflow from sources including fans and convection, and from geometries including horizontal and vertical mounting geometries. The silicon wall may be utilized for preventing heat airflow generated by heat radiated from one component from impinging upon another component.