Silicon Watch Component Manufacturing via Mechanical Leveling
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Solution Overview
Problem
Existing methods for manufacturing silicon watch components on SOI wafers are complex, time-consuming, and expensive due to the multiple microfabrication steps required for component release.
Innovation Solution
A method involving the formation of watch components in a wafer thicker than the maximum component thickness, followed by mechanical leveling to thin the wafer, allowing for simple, fast, and economical component release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If SOI wafers are used with multiple microfabrication steps for component release, then manufacturing precision is improved, but device complexity and manufacturing time increase
Solution Approach 1:
The patent extracts and removes the support layer from the SOI wafer structure through selective etching. By eliminating the support layer, the complex multi-step release process is simplified while maintaining component precision. The components are released from the support layer through targeted etching processes that remove only the necessary supporting structures.
Solution Approach 2:
The patent performs preliminary actions by pre-structuring the SOI wafer with defined etch stops and support layer configurations before component fabrication. This preliminary preparation enables simpler subsequent release processes, reducing overall manufacturing complexity while ensuring precise component formation.
2Manufacturing precision
If multiple microfabrication steps are used for component release, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The patent merges multiple release operations into a unified etching process. By combining support layer removal, component release, and surface preparation into integrated process steps, productivity is enhanced while maintaining the precision required for high-quality watch components.
Solution Approach 2:
The patent replaces complex mechanical release operations with chemical etching processes. This substitution eliminates time-consuming mechanical manipulation steps while achieving precise component release, thereby improving productivity without sacrificing manufacturing precision.
3Manufacturing precision
If multiple microfabrication steps are used for component release, then manufacturing precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent employs selective etching that removes (discards) the support layer material in a controlled manner. By recovering and reusing etching solutions and optimizing material removal efficiency, the cost of manufacturing is reduced while maintaining the precision needed for high-quality silicon watch components.
4Ease of manufacture
If etching is performed on thin wafers without support, then component release is achieved, but manufacturing difficulty increases
Solution Approach 1:
The patent performs preliminary preparation by maintaining the support layer during etching operations. This preliminary configuration provides mechanical support during the etching process, preventing wafer damage while enabling successful component release. The support layer is removed only after etching is complete, simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces costs, and accelerates production by enabling efficient mechanical leveling for component release, while maintaining the precision and quality of the components.
Implementation Method 1
a grinding wheel (101) carrying abrasion members (102) which act against the wafer (10, 110) from its lower side (10A, 110A)
Data Source
Figure 1a~1d
Figure 1e~1h
Figure 1i~1k
AI summary
A method for manufacturing a plurality of watch components (90) in a wafer is described. The method comprises the following steps: (a) providing a wafer (10, 110), having a lower side (10A, 110A) and an upper side (10B, 110B), the initial thickness of the wafer (e30, e110) being greater than the maximum thickness of the watch components (e90) to be manufactured, said wafer comprising at least one silicon layer (30, 130) in which the watch components (90) are formed; (b) forming the watch components (90) by etching patterns in the silicon layer (30, 30', 130, 130') from the upper side (10B, 110B) of the wafer (10, 110); and (c) performing mechanical leveling from the bottom side (10A, 110A) of the wafer (10, 110) to remove a portion of the wafer (10, 110) by thinning the thickness of said wafer (10, 110).