Silicon Watch Components 3D Shaping via Thermal Deformation
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Solution Overview
Problem
Existing methods for manufacturing watch components from fragile materials like silicon restrict the ability to create complex three-dimensional geometries due to the necessity of substantially vertical flanks and are complex to implement, limiting design choices.
Innovation Solution
A method involving deep reactive ion etching of silicon wafers followed by heat treatment between 500 °C and 1300 °C, where a tool with protrusions deforms the components to achieve permanent plastic deformation and allow for three-dimensional shaping, enabling the creation of curved or complex forms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography and anisotropic engraving steps are used to manufacture watch components, then components can be manufactured with precise two-dimensional structuring, but the components necessarily have substantially vertical flanks which drastically limit three-dimensional geometry design choices
Solution Approach 1:
The patent changes the temperature parameter to transform silicon from a fragile state at room temperature to a ductile state at high temperature (500-1300°C). This parameter change enables the material to be permanently deformed into complex three-dimensional shapes while maintaining manufacturing precision through controlled thermal processing
Solution Approach 2:
The patent applies preliminary action by first structuring the silicon wafer into desired two-dimensional patterns using photolithography and engraving, then subsequently deforming these structured areas into three-dimensional shapes. This sequence allows precise 2D structuring to be preserved while adding 3D complexity
2Ease of manufacture
If a combination of photolithography and anisotropic engraving steps is used, then tiered components with superimposed planar layers can be created, but the manufacturing process becomes complicated to implement
Solution Approach 1:
The patent simplifies the manufacturing process by using temperature parameter changes to enable direct three-dimensional deformation of structured silicon areas. This eliminates the need for multiple complex anisotropic engraving steps and photolithography iterations, reducing overall process complexity while maintaining ease of manufacture
Solution Approach 2:
The patent replaces complex mechanical engraving systems with a thermal field approach. By heating silicon to ductile temperatures and applying controlled deformation forces, the process achieves three-dimensional shaping without requiring complicated multi-step mechanical engraving equipment and procedures
3Adaptability or versatility
If silicon wafer is heated to between 500 °C and 1300 °C for plastic deformation, then permanent deformation and three-dimensional shaping become possible, but additional equipment and process control are required
Solution Approach 1:
The patent achieves multi-functionality by using a single heat treatment step that simultaneously enables permanent deformation, three-dimensional shaping, and material ductilization. This universal thermal process replaces multiple specialized manufacturing steps, justifying the additional equipment through consolidated functionality
Solution Approach 2:
The patent uses controlled parameter changes (temperature, time, deformation force) to enable three-dimensional shaping. By precisely controlling these parameters during heat treatment, the process achieves complex geometries while managing equipment complexity through systematic parameter optimization rather than requiring overly complex equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of watch components with intricate three-dimensional shapes that were previously impossible, offering enhanced design flexibility and functionality while maintaining mechanical integrity.
Implementation Method 1
At these temperatures, silicon becomes ductile and can therefore deform permanently
Implementation Method 2
the silicon wafer 10 with its watch components 11 is placed in a furnace to be subjected to heat treatment, at a temperature typically between 500 °C and 1300 °C
Data Source
Figure 1(a)~1(e)
Figure 2
Figure 3~4
AI summary
The method for manufacturing watch components from brittle material according to the invention comprises the following steps: a) making watch components (11) in a wafer (10) of brittle material, the watch components (11) remaining attached to the wafer (10) by material bridges (12); b) subjecting the watch components (11) to a heat treatment and, during this heat treatment, applying by means of a tool (14) a stress on at least one area (16) of at least one of the watch components (11) in order to deform it permanently, the at least one of the watch components (11), excluding the at least one area (16), being supported against a support (13) during the application of the stress; c) after step b), detaching the watch components from the wafer (10).