Silicon Wiring Substrate with Side Surface Wire Terminals
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Solution Overview
Problem
Existing ceramic wiring substrates face difficulties in forming micro wirings, making them unsuitable for high-performance electronic components and challenging to mount components like MEMS acceleration sensors with side surface connection terminals.
Innovation Solution
A silicon substrate with through holes, insulating layers, penetration electrodes, and metal wire terminals formed using the wire bonding method, allowing for the formation of micro wirings and easy connection terminals on the side surface, enabling the mounting of high-performance electronic components with improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a ceramic package is used, then connection terminals can be provided on the side surface, but micro wirings cannot be formed
Solution Approach 1:
The invention changes the substrate material from ceramic to silicon, which has different physical and chemical properties that enable micro wiring formation while maintaining side surface connection capability. This material parameter change resolves the contradiction by allowing both micro wiring fabrication and side surface terminal provision.
Solution Approach 2:
The invention uses a composite structure combining silicon substrate with metal penetration electrodes and insulating layers. This composite approach allows the substrate to support micro wirings while the penetration electrodes provide the side surface connection function, effectively resolving the contradiction between material properties and connection requirements.
2Device complexity
If a ceramic substrate is used, then the package structure is simple, but it cannot serve as a mounting substrate for high-performance electronic components
Solution Approach 1:
The invention changes the substrate material parameter from ceramic to silicon, which fundamentally improves the mounting capability for high-performance electronic components while maintaining a relatively simple package structure. The silicon substrate's superior electrical and mechanical properties enable this improvement.
3Ease of operation
If metal wire terminals are formed on the side surface, then connection is facilitated, but the substrate must support both micro wirings and side surface terminals
Solution Approach 1:
The invention segments the connection function by providing separate penetration electrodes within through-holes and metal wire terminals on the side surface. This segmentation allows the substrate to handle micro wirings through the penetration electrodes while providing side surface connections through the wire terminals, resolving the contradiction between connection ease and structural complexity.
Solution Approach 2:
The penetration electrodes act as intermediaries between the micro wiring layer and the side surface wire terminals. They provide the necessary electrical connection path while allowing the substrate structure to maintain its integrity and support both types of connections simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of micro wirings and easy connection terminals on the side surface of the substrate, facilitating the mounting of high-performance electronic components, such as MEMS acceleration sensors, with enhanced reliability and reduced instability, and allows for flexible orientation of electronic devices during mounting.
Implementation Method 1
The metal wire terminal is made of a gold wire which is formed by the wire bonding method, for example.
Data Source
AI summary
A wiring substrate includes a silicon substrate, a through hole formed to penetrate the silicon substrate in a thickness direction, an insulating layer formed on both surfaces and side surfaces of the silicon substrate and an inner surface of the through hole, a penetration electrode formed in the through hole, a wiring layer formed on at least one surface of the silicon substrate and connected to the penetration electrode, and a metal wire terminal connected to the wiring layer and formed to extend from one surface of the silicon substrate to a side surface thereof. The metal wire terminal on the side surface of the electronic device is connected to the mounting substrate such that a substrate direction of the electronic device in which an electronic component is mounted on the wiring substrate intersects orthogonally with a substrate direction of the mounting substrate.