Silicone Adhesive Composition for Low-Temperature Plastic Bonding

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Solution Overview

Problem

Conventional silicone adhesives lack functional groups to chemically adhere to high-performance engineering plastics, leading to low adhesive strength and risk of dimensional deformation during high-temperature curing.

Innovation Solution

A silicone composition comprising organopolysiloxanes with C2 to C20 alkenyl groups and organohydrogen siloxanes with SiH functional groups, along with adhesion promoters and catalysts, allows for rapid curing at low temperatures, enhancing adhesion to plastics like polycarbonate, PET, and PMMA.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional silicone adhesives are used without functional groups for chemical adhesion, then the adhesive composition is simple, but the adhesive strength to high-performance engineering plastics is low

Engineering Contradiction:
Improveadhesive strengthVSAvoidchemical structure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent modifies the chemical structure parameters of the silicone adhesive by introducing specific functional groups (vinyl groups at both ends and silicon hydrogen groups in the chain) to enable chemical bonding with plastic substrates. This changes the adhesion mechanism from physical to chemical bonding, significantly improving adhesive strength without excessive complexity.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite adhesive system combining organopolysiloxane with vinyl groups and organohydrogen polysiloxane with silicon hydrogen groups. This composite structure enables dual functionality: the vinyl groups provide crosslinking capability while the silicon hydrogen groups enable chemical adhesion to plastics, achieving both strong bonding and structural integrity.

Inventive Principle:
Principle #40Composite materials

2Strength

If thermosetting silicone adhesive is cured at high temperature for long time, then the adhesive strength is sufficient, but dimensional deformation of plastic substrate occurs

Engineering Contradiction:
Improveadhesive strengthVSAvoiddimensional stability
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent changes the curing temperature parameter from high temperature to low temperature (room temperature or slightly elevated) by utilizing platinum-catalyzed hydrosilylation reaction. This parameter change allows the adhesive to achieve full curing and sufficient strength without causing thermal deformation to the plastic substrate, maintaining dimensional stability.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the thermal curing mechanism with a catalytic chemical reaction mechanism. Instead of relying on heat to drive the curing reaction, the system uses platinum catalyst to enable the hydrosilylation reaction between vinyl groups and silicon hydrogen groups at low temperatures, substituting thermal energy with catalytic action.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If conventional silicone adhesive is used, then the composition is simple, but the curing time is long and productivity is low

Engineering Contradiction:
Improvecuring speedVSAvoidcomposition complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent introduces platinum catalyst as an intermediary substance that dramatically accelerates the curing reaction. The catalyst mediates the hydrosilylation reaction between the vinyl groups and silicon hydrogen groups, reducing curing time from hours to minutes while adding only minimal complexity to the composition.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the reaction kinetics parameters by introducing catalysis. The platinum catalyst lowers the activation energy barrier for the hydrosilylation reaction, transforming it from a slow uncatalyzed reaction to a rapid catalyzed reaction, thereby significantly improving curing speed and productivity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition exhibits stable adhesion to various plastics, minimizes dimensional deformation, and provides rapid curing, suitable for bonding and assembly in automotive and electronic components, including outdoor displays.

Implementation Method 1

a first organopolysiloxane including a C2 to C20 alkenyl group bonded to at least one Si at both ends or a chain... an organohydrogen siloxane comprising at least two SiH functional groups per molecule

Methodology Applied
Scientific EffectAddition reaction: Chemical Bonding

Implementation Method 2

The compositions further comprise a hydrosilylation catalyst and a reaction inhibitor

Methodology Applied
Scientific EffectHydrosilylation: Chemical Bonding

Implementation Method 3

a catalytic amount of a catalyst based on a platinum group metal

Methodology Applied
Scientific EffectCatalysis: Catalysis

Data Source

PatentEP4565639B1Silicone compositions
Publication Date: 2026.03.04 WACKER CHEMIE AG

AI summary

The present disclosure provides a silicone composition including: (a1) a first organopolysiloxane including a C2 to C20 alkenyl group bonded to at least one Si at both ends or a chain, the first organopolysiloxane formed from a unit represented by (R3SiO1/2)a(R2SiO2/2)b(RSiO3/2)c(SiO4/2)d (wherein a is in a range of 1 to 50, b is in a range of 100 to 500, c is in a range of 0 to 50, and d is in a range of 0 to 50); (a2) a second organopolysiloxane including a C2 to C20 alkenyl group bonded to at least one Si at both ends or a chain, and including at least one unit represented by SiO4/2; and (b) an organohydrogen siloxane comprising at least two SiH functional groups per molecule and comprising at least one C6 to C20 aryl group.