Inkjet-Printable Silicone Adhesive Composition for Thin Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional curable silicone compositions for inkjet printing of adhesive layers in (opto)electronic device fabrication have high viscosities due to the use of linear silicone gum and volatile solvents, making them unsuitable for achieving thin layers (< 50 µm) and posing environmental concerns.
Innovation Solution
A curable silicone composition with a viscosity of less than 100 mPa·s, comprising an aromatic compound with two alkenyl groups, an aromatic compound with two silicon-bonded hydrogen atoms, an alkenyl functional polyorganosilicate resin, and optional components like a reactive diluent and a hydrosilylation reaction catalyst, which can be printed using inkjet technology to form thin adhesive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional curable silicone compositions use linear silicone gum and solid tackifier resin, then adhesion force is improved, but viscosity increases making inkjet printing difficult
Solution Approach 1:
The patent changes the chemical composition parameters by replacing linear silicone gum with vinyl-functional polyorganosilicate resin and adjusting the ratio of aromatic compounds with alkenyl groups to aromatic compounds with silicon-bonded hydrogen atoms. This compositional parameter change achieves both low viscosity (<100 mPa·s) and high adhesion force (>100 gf/in), resolving the contradiction between ease of inkjet printing and adhesion strength
Solution Approach 2:
The patent creates a composite silicone pressure sensitive adhesive composition combining multiple components: vinyl-functional polyorganosilicate resin, aromatic compounds with alkenyl groups, aromatic compounds with silicon-bonded hydrogen atoms, and optional reactive diluents. This composite material approach achieves synergistic effects where the combination provides both low viscosity for inkjet printing and high adhesion force, resolving the contradiction between these two properties
2Ease of operation
If volatile solvents are added to reduce viscosity, then ease of coating is improved, but environmental harm and non-uniform drying occur
Solution Approach 1:
The patent extracts and removes volatile solvents from the composition entirely, creating a solventless silicone pressure sensitive adhesive. By eliminating the harmful volatile solvent component while maintaining low viscosity through alternative compositional strategies (vinyl-functional polyorganosilicate resin and aromatic compounds), the patent achieves ease of coating without environmental harm or drying non-uniformity
Solution Approach 2:
The patent changes the physical state parameter of the composition by formulating a solventless system. This parameter change eliminates evaporation-related problems (non-uniform drying, shrinkage) and environmental harm while maintaining processability through careful selection of low-viscosity base resins and reactive diluents
3Ease of operation
If solvent drying process is used, then viscosity reduction is achieved, but manufacturing time and process complexity increase
Solution Approach 1:
The patent extracts and eliminates the solvent drying process entirely by formulating a solventless composition. The viscosity control is achieved through compositional design (vinyl-functional polyorganosilicate resin, aromatic compounds, optional reactive diluents) rather than through solvent evaporation, completely removing the time-consuming drying step and associated process complexity
4Strength
If conventional adhesive layers are formed by dispensing or lamination, then adhesion is achieved, but layer thickness cannot be reduced below 50 µm
Solution Approach 1:
The patent changes the viscosity parameter to <100 mPa·s, which enables inkjet printing deposition of ultra-thin adhesive layers. This parameter change allows achieving layer thickness ≤50 µm (down to 1 µm) while maintaining adhesion force >100 gf/in through the unique composition of vinyl-functional polyorganosilicate resin and aromatic compounds with controlled SiH/Vi ratio
Solution Approach 2:
The patent replaces conventional mechanical application methods (dispensing, lamination) with inkjet printing technology. This substitution enables precise control of layer thickness at the micrometer and sub-micrometer scale, achieving thickness ≤50 µm that is difficult to obtain through mechanical means, while the cured adhesive maintains high adhesion strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of thin silicone pressure sensitive adhesive layers with high adhesion force and suitable modulus, suitable for (opto)electronic device fabrication, while avoiding the use of volatile solvents and achieving low viscosity for inkjet printing.
Implementation Method 1
a curable silicone composition comprises: (A) an aromatic compound having two alkenyl groups per molecule... (B) an aromatic compound having two silicon bonded hydrogen atoms per molecule... (C) an alkenyl functional polyorganosilicate resin... (G) a hydrosilylation reaction catalyst
Data Source
Figure 1
AI summary
A curable silicone composition has viscosity ≤ 100 mPa· s at 25 °C. The composition is suitable for use in a printing method. The composition can cure via hydrosilylation reaction to form a silicone adhesive suitable for use in the field of (opto)electronic device fabrication.