Addition Curable Silicone Bonding Material for Semiconductor Susceptor
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Solution Overview
Problem
Conventional bonding materials for semiconductor manufacturing devices, such as liquid silicone rubber and indium-containing metal layers, cause susceptor warping and contamination, while organic adhesives have poor heat resistance, leading to issues with flatness and process contamination.
Innovation Solution
A heat-resistant bonding material composed of an addition curable silicone adhesive agent with specific organopolysiloxane and organohydrogenpolysiloxane ratios, a platinum catalyst, and a heat conductive filler content between 20-50 vol%, which maintains susceptor flatness and prevents process contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If liquid silicone rubber is used for joining the susceptor to the cooling board, then the bonding strength is improved, but the susceptor suffers warping because the volume of the liquid silicone rubber shrinks by curing
Solution Approach 1:
The patent changes the curing mechanism parameter from condensation curing (which causes shrinkage) to addition curing (which causes minimal shrinkage). The bonding material uses an addition-curable silicone adhesive agent containing vinyl-containing polysiloxane and SiH-containing polysiloxane, which cures without the volume shrinkage problem of conventional condensation-curing materials, thereby maintaining susceptor flatness while achieving bonding strength.
Solution Approach 2:
The patent creates a composite bonding material system combining addition-curable silicone adhesive agent with specific fillers (aluminum oxide, aluminum nitride, or silicon carbide) and catalysts. This composite formulation achieves both adequate bonding strength and minimal shrinkage, resolving the contradiction between strength and flatness maintenance.
2Strength
If an In-containing metal layer is used for joining, then the bonding strength is improved, but the manufacturing process is contaminated with In
Solution Approach 1:
The patent extracts and removes the harmful indium element from the bonding material composition entirely. Instead of using In-containing metal layers, the patent employs an organic-inorganic hybrid bonding material based on addition-curable silicone adhesive agents, which provides adequate bonding strength without introducing contamination into the semiconductor manufacturing process.
Solution Approach 2:
The patent replaces the reusable but contaminating In-containing metal layer with a disposable bonding material layer that serves its purpose and can be discarded without causing contamination. The silicone-based bonding material achieves the required bonding function and can be removed or replaced without leaving harmful residues in the manufacturing process.
3Ease of manufacture
If an organic adhesive agent is used for joining, then the ease of manufacture is improved, but the heat resistance of the composite deteriorates since the heat resisting temperature is as low as about 100° C.
Solution Approach 1:
The patent creates an organic-inorganic hybrid composite material that combines the ease of application of organic adhesives with the heat resistance of inorganic materials. The bonding material consists of an addition-curable silicone adhesive agent (organic component) reinforced with inorganic fillers such as aluminum oxide, aluminum nitride, or silicon carbide, achieving both manufacturability and heat resistance up to 300°C or higher.
Solution Approach 2:
The patent changes the chemical composition parameters of the bonding material by incorporating heat-resistant inorganic fillers and using addition-curable silicone chemistry instead of conventional organic adhesives. This parameter change elevates the heat resistance from 100°C to 300°C or higher while maintaining the ease of application through paste or sheet forms.
4Reliability
If the content of heat conductive filler is increased to improve heat conductivity, then the heat conductivity is improved, but the adhesiveness of the bonding material decreases
Solution Approach 1:
The patent optimizes the filler content parameter to a specific range (20-50 wt%) where the bonding material achieves both adequate heat conductivity and adhesiveness. This parameter optimization prevents excessive filler loading from compromising the adhesive matrix continuity while ensuring sufficient heat conduction capability for the semiconductor processing application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bonding material provides improved heat resistance and adhesiveness, maintaining susceptor flatness and preventing contamination, while ensuring sufficient heat conductivity and adhesion between the susceptor and cooling board.
Implementation Method 1
The addition curable silicone adhesive agent contains an organopolysiloxane containing two or more vinyl groups per one molecule; an organopolysiloxane resin containing a unit (hereinafter, 'M') represented by R3SiO1/2 and a unit (hereinafter, 'Q') represented by SiO4/2 in a molar ratio (M/Q ratio) of equal to or more than 0.6 to equal to or less than 1.6; an organohydrogenpolysiloxane containing a silicon atom-bonding hydrogen atom; a platinum catalyst
Implementation Method 2
a heat conductive filler whose content falls within the range equal to or more than 20 to equal to or less than 50 vol %
Data Source
AI summary
The bonding material is formed of a cured sheet composed of an addition curable silicone adhesive agent, and the addition curable silicone adhesive agent contains an organopolysiloxane containing two or more vinyl groups per molecule; an organopolysiloxane resin containing a unit (hereinafter, “M”) represented by R3SiO1/2 (R is a monovalent hydrocarbon group having 1 to 6 carbon atoms and containing no aliphatic unsaturated bond) and a unit (hereinafter, “Q”) represented by SiO4/2 in a molar ratio (M/Q ratio) equal to or more than 0.6 to equal to or less than 0.6 to 1.6; an organohydrogenpolysiloxane containing a silicon atom-bonding hydrogen atom; a platinum catalyst; and a heat conductive filler whose content falls within the range equal to or more than 20 vol % to equal to or less than to 50 vol %.