Multifunctional Silicone Coating for Fast PCB Module Protection

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Solution Overview

Problem

Conventional silicone materials for protecting electronic devices require multiple coating steps and lengthy curing times, prolonging manufacturing time and necessitating separate trays and coating apparatuses due to different curing times for conformal coating, damp-proofing, vibration-absorbing, thermally conducting, and ESD protecting functions.

Innovation Solution

A silicone material comprising a base resin, thermal initiator, photoinitiator, ESD protecting filler, and thermally conductive filler, which can be cured using light and heat within 10 to 60 seconds, enabling a single coating step for conformal coating, damp-proofing, vibration-absorbing, thermally conducting, and ESD protecting functions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple types of silicone materials are used for different protective functions (conformal coating, damp-proofing, vibration-absorbing, thermally conducting, ESD protecting), then the electronic device receives comprehensive protection, but the manufacturing process time is prolonged due to sequential coating steps

Engineering Contradiction:
Improveprotection effectivenessVSAvoidmanufacturing process time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent combines multiple protective functions (conformal coating, damp-proofing, vibration-absorbing, thermally conducting, and ESD protecting) into a single integrated silicone material. This material contains fillers that simultaneously provide thermal conduction, ESD protection, and mechanical cushioning, eliminating the need for sequential coating of separate materials and reducing manufacturing time while maintaining comprehensive protection.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The silicone material is designed with multi-functionality to perform multiple protective roles simultaneously. By incorporating specific fillers (such as aluminum oxide for ESD protection, thermally conductive particles, and rubber particles for vibration absorption) into a single silicone matrix, the material becomes universal and can replace multiple specialized materials in one application step.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple types of silicone materials are coated in sequence for different functions, then comprehensive protection is achieved, but separate trays and multiple coating apparatuses are required

Engineering Contradiction:
Improveprotection effectivenessVSAvoidcoating apparatus complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple coating operations into a single coating process by using an integrated silicone material that contains all necessary functional fillers. This eliminates the need for multiple coating apparatuses and separate trays, simplifying the manufacturing equipment while maintaining comprehensive protective coverage.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The multi-functional silicone material allows a single coating apparatus to apply all protective layers simultaneously. The material's universal nature means one coating step can provide conformal coating, damp-proofing, vibration-absorbing, thermally conducting, and ESD protecting functions, reducing equipment complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If conventional silicone materials with curing time of approximately 30 minutes are used for each coating step, then adequate curing is achieved, but the total manufacturing time is considerably prolonged

Engineering Contradiction:
Improvecuring qualityVSAvoidcuring time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent modifies the curing parameters by using a photoinitiator system that enables UV light curing instead of conventional thermal curing. This changes the curing mechanism from heat-based (30 minutes) to light-based (seconds to minutes), dramatically reducing curing time while maintaining adequate curing quality through controlled UV exposure.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the thermal curing mechanism (mechanical heating system) with a photopolymerization mechanism (UV light system). This substitution allows curing to occur much faster since UV light can initiate and complete the curing process in seconds to minutes, compared to the prolonged thermal curing time of conventional silicones.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The silicone material significantly reduces manufacturing time by achieving all protective functions in a single step with a curing time of 60 seconds, ensuring effective protection of electronic devices under high temperature and humidity, and ESD conditions while maintaining normal electrical performance.

Implementation Method 1

a base resin, a thermal initiator and a photoinitiator

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

a base resin, a thermal initiator and a photoinitiator

Methodology Applied
Scientific EffectThermal initiation:

Implementation Method 3

thermally conducting silicone for transmitting heat to the electronic device or discharging heat from the electronic device

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

ESD protecting silicone for protecting the electronic device from ESD

Methodology Applied
Scientific EffectElectrostatic discharge protection: Electrostatic Discharge

Data Source

PatentEP2876138B1Silicone material for protecting electronic devices, circuit module using the same and manufacturing method of circuit module
Publication Date: 2024.01.10 SAMSUNG SDI CO LTD
  • EP2876138B1 patent drawingFigure 1A~1B
  • EP2876138B1 patent drawingFigure 1C~2
  • EP2876138B1 patent drawingFigure 3~4

AI summary

Silicone material for protecting electronic devices, which has conformally coating, damp-proofing, vibration absorbing, thermally conducting and electrostatic discharge (ESD) protecting functions, and is cured within 60 seconds, a circuit module using the same, and a manufacturing method of the circuit module. The silicone material includes a base resin, a thermal initiator, and a photoinitiator. In addition, the circuit module includes a printed circuit board having a plurality of circuit patterns formed on an insulating layer, a plurality of electronic devices electrically connected to the circuit patterns by solders, and the silicone material coated on at least one of the circuit patterns, the solders and the electronic devices. Further, the manufacturing method of the circuit module includes providing a printed circuit board having a plurality of circuit patterns formed on an insulating layer and electrically connecting a plurality of electronic devices to the circuit patterns by solders, coating silicone material on at least one of the circuit patterns, the solders and the electronic devices, and curing the silicone material using light and heat.